Additive Manufacturing is the peer-reviewed journal that provides academia and world-leading industry with high quality research papers and reviews in additive manufacturing. The journal aims to acknowledge the innovative nature of additive manufacturing and its broad applications to outline the current and future developments in the field.

Additive manufacturing technologies are positioned to provide a disruptive transformation in how products are designed and manufactured. From this, there was a need to create a fast-publication journal which provides a unique publication outlet for engineers, materials scientists and practitioners in academia and virtually any industry as these technologies are incorporated in new product and medical implant design and manufacturing.

The journal covers a wide scope, comprising new technologies, processes, methods, materials, systems, and applications in the field of additive manufacturing. Topics of particular interest include, but are not limited to:

Design and Modeling
• Multiple material components and devices Heterogeneous Design
• Heterogeneous Design
• Modeling from concept to manufacture to implementation to disposal - the entire product life cycle

Additive manufacturing processes and process enhancements
• Advancements in additive manufacturing processes
• Multi-technology (hybrid) systems
• Enhanced closed-loop control of additive manufacturing systems

Multiple and novel materials
• Characterization and performance - mechanical, electrical, chemical, biological, opticals
• New material formulations and composite materials
• Processing of materials in additive manufacturing and for use in additive manufacturing

Special applications with multi-functionality
• Medical additive manufacturing and bio-printing
• Optimized configurations such as topology optimization
• Additive manufacturing for space and in-space additive manufacturing
• Improved energy utilization in and using additive manufacturing
• Nano-additive manufacturing
• Electromechanical and robotic systems
• 3D electronics, electromagnetics, and metamaterials
• Other novel applications of additive manufacturing

Editorial board

Editor-in-Chief

  • R. Wicker
    W. M. Keck Center for 3D Innovation, University of Texas at El Paso, Texas, USA

Deputy Editor

  • E. MacDonald
    Youngstown State University, USA

Managing Editor

  • M. Perez
    W. M. Keck Center for 3D Innovation, University of Texas at El Paso, Texas, USA

Editorial Board

  • A Bandyopadhyay
    Washington State University, Pullman, Washington, USA
  • J Beaman
    University of Texas at Austin, Austin, Texas, USA
  • J. Beuth
    Carnegie Mellon University, Pittsburgh, Pennsylvania, USA
  • S. Bose
    Washington State University, Pullman, Washington, USA
  • S. Chen
    University of California at San Diego (UCSD), California, USA
  • J.W Choi
    University of Akron, Ohio, USA
  • K. Chou
    University of Alabama, Tucaloosa, Alabama, USA
  • D. Cormier
    Rochester Institute of Technology, Rochester, NY, USA
  • K. Creehan
    The National Additive Manufacturing Innovation Institute, Blairsville, PA, USA
  • C. Elkins
    Stanford University, California, USA
  • S. Fish
    University of Texas at Austin, Austin, Texas, USA
  • D.D. Gu
    Nanjing University of Aeronautics and Astronautics, Nanjing, China
  • O. Harrysson
    North Carolina State University, Raleigh, North Carolina, USA
  • D. Hofmann
    NASA Jet Propulsion Laboratory, California, USA
  • N. Hopkinson
    University of Sheffield, England, UK
  • Y. Huang
    University of Florida, Florida, USA
  • K. Jurrens
    National Institute of Standards and Technology (NIST), Gaithersburg, Maryland, USA
  • K.F. Leong
    Nanyang Technological University, Singapore
  • J. Lewis
    Harvard University, Massachusetts, USA
  • L. Love
    Oak Ridge National Laboratory, Tennessee, USA
  • R. Martukanitz
    Penn State University, Pennsylvania, USA
  • D. Mei
    Zhejiang University, China
  • R. Resnick
    America Makes - the National Additive Manufacturing Innovation Institute, Ohio, USA
  • D. Rosen
    Georgia Institute of Technology, Georgia, USA
  • C. Spadaccini
    Lawrence Livermore National Laboratory, California, USA
  • B. Stucker
    University of Louisville, Louisville, Kentucky, USA
  • A.C. To
    University of Pittsburgh, Pittsburgh, Pennsylvania, USA
  • C. Tuck
    Nottingham, England, UK
  • C. Williams
    Virginia Tech, Blacksburg, Virginia, USA