Extreme Mechanics Letters (EML) enables rapid communication of research that highlights the role of mechanics in multi-disciplinary areas across materials science, physics, chemistry, biology, medicine and engineering. Emphasis is on the impact, depth and originality of new concepts, methods and observations at the forefront of applied sciences.

EML publishes letter-sized articles, as well as invited reviews and articles on topics of special interest. The goal is to have the papers published online within 6-8 weeks upon submission.

EML covers experimental, theoretical, and computational mechanics of processes at all size and time scales. Of particular interest is the progress in mechanics that advances the fields of vital importance to the society, including, but not limited to, health science, energy systems, the environment, food and water, climate, and security.

Among the topical areas of interest are:

• Materials of extreme properties, such as exceptional hardness or softness
• Materials under extreme conditions, such as high temperature and high loading rate
• Stretchable, wearable, or implantable electronics for entertainment or healthcare
• Soft robots in manufacturing, surgery and assisted living
• Robots that crawl, run, swim or fly
• Biomimetics that perceive, act, learn and remember
• Active materials in response to mechanical, chemical, electrical, thermal stimuli
• Instability and large deformation in nature and engineering systems
• Force-induced configurational changes of proteins leading to cascades in cellular responses
• Deformation, transport and fracture in high-efficiency batteries
• Interfacial phenomena in interactions between fluids and solids, deformation and failure of materials, and processes of living cells
• Self-assembly of materials and devices
• Thin-membrane origami and kirigami
• Mechanics of 3D printing
• Materials and structures of hierarchical architectures
• Hybrid systems of air, liquids, and solids
• Earthquakes and hydraulic fracture
• Foldable, lightweight structures for space exploration

Editorial board

Editors-in-Chief

  • K. J. Hsia
    Dept. of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania, USA
  • J. A. Rogers
    Dept. of Materials Science & Engineering, Northwestern University, Evanston, Illinois, USA
  • Z. Suo
    School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts, USA

Associate Editors

  • K. Bertoldi
    School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts, USA
  • C. Daraio
    Thomas Laboratory, California Institute of Technology, Pasadena, California, USA
  • J. R. Greer
    Materials Science and Mechanics, California Institute of Technology, Pasadena, California, USA
  • H. Jiang
    Dept. of Mechanical & Aerospace Engineering, Arizona State University, Tempe, Arizona, USA
  • T. Li
    Clark School of Engineering, University of Maryland, College Park, Maryland, USA
  • S. Zhang
    Department of Engineering Science & Mechanics, Pennsylvania State University, University Park, Pennsylvania, USA

Advisory Board

  • M. C. Boyce
    Columbia University, New York, New York, USA
  • L. B. Freund
    University of Illinois at Urbana-Champaign, Urbana, Illinois, USA and Brown University, Providence, Rhode Island, USA
  • H. Gao
    Brown University, Providence, Rhode Island, USA
  • Y. Huang
    Northwestern University, Evanston, Illinois, USA
  • J. W. Hutchinson
    Harvard University, Cambridge, Massachusetts, USA
  • D. E. Ingber
    Harvard University, Boston, Massachusetts, USA
  • S. Kyriakides
    University of Texas at Austin, Austin, Texas, USA
  • S. Suresh
    Carnegie Mellon University, Pittsburgh, Pennsylvania, USA
  • J. A. Todd
    Pennsylvania State University, Pennsylvania, USA
  • V. Tvergaard
    Danmarks Tekniske Universitet (DTU), Kgs. Lyngby, Denmark
  • G. M. Whitesides
    Harvard University, Cambridge, Massachusetts, USA
  • W. Yang
    Zhejiang University, China

Editorial Board

  • I. A. Anderson
    Auckland Bioengineering Institute, Auckland, New Zealand
  • B. Audoly
    Laboratoire de mécanique des solides, Palaiseau CEDEX, France
  • S. Bauer
    Johannes Kepler University Linz, Linz, Austria
  • M. J. Buehler
    Massachusetts Institute of Technology, Cambridge, Massachusetts, USA
  • F. Carpi
    Queen Mary University of London, London
  • D. Fang
    Beijing Institute of Technology, Beijing, China
  • X. Guo
    Dalian University of Technology, Dalian, China
  • H. T. Johnson
    University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
  • S. P. Lacour
    Ecole Polytechnique Federale de Lausanne, Lausanne, Switzerland
  • J. Li
    Massachusetts Institute of Technology, Cambridge, Massachusetts, USA
  • C. T. Lim
    National University of Singapore, Singapore
  • M. C. McAlpine
    University of Minnesota, Minneapolis, Minnesota, USA
  • P. R. Onck
    University of Groningen, Groningen, Netherlands
  • M. L. Oyen
    University of Cambridge, Cambridge, England, UK
  • B. L. Pruitt
    Stanford University, California, USA
  • P. M. Reis
    Massachusetts Institute of Technology, Cambridge, Massachusetts, USA
  • B. Roman
    PMMH - ESPCI, Paris Cedex 5, France
  • M. T. A. Saif
    University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
  • K. J. Van Vliet
    Massachusetts Institute of Technology, Cambridge, Massachusetts, USA
  • Q. Zheng
    Tsinghua University, China
  • T. Zhu
    Georgia Institute of Technology, Atlanta, Georgia, USA