IPC, the Association Connecting Electronics Industries, in conjunction with co-host Amkor Technology, has released the agenda for the IPC Conference on Component Technology. The conference is slated to take place take place September 10–12, 2013, at the Hilton Phoenix Chandler in Chandler, Ariz.
The theme of the event, "Closing the Gap in the Chip to PCB Process," is designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance. Produced by IPC together with co-host Amkor Technology.
There’s tremendous pressure to innovate at the component level, and that’s driving the research behind new approaches to design, materials and processes,” said Ron Huemoeller, senior vice president, advanced product development, Amkor Technology, Inc
. “This event provides access to the experts who are behind the latest advancements in IC-to-board-level interconnections.”
The event begins Tuesday, Sept. 10, with two workshops. Phil Marcoux, PPM Associates, will present a half-day workshop on “Design and Fabrication of Semiconductor Package Interposers and Substrates for Today’s Demanding Applications." The afternoon workshop, presented by Nozad Karim, Amkor Technology, addresses “System Integration and Design Challenges.”
Wednesday, Sept. 11, opens with a keynote, “What is Happening at the Package/System Integration Level?” featuring Ron Huemoeller. Technical conference sessions for the rest of the day cover the following: Trends in Advanced Circuit Board Technologies, presented by Hayao Nakahara, N.T. Information Ltd.; Advancements in Silicon Interposers and Alternatives, presented by Linda Matthews, TechSearch International Inc.; The impact of Different Interposers on Power Saving for Memory Modules, presented by Nozad Karim; Techniques in Copper Plating and Etching, presented by Lynn Michaelson, Technic, Inc
.; Next-Generation Packaging, presented by Mark Poliks, Endicott Interconnect Technologies; Sintering Pastes, featuring Jim Haley, Ormet Circuits; Copper Foils in Low-Loss and High-Speed and the IC Packaging Process, presented by Rocky Hilburn, Insulectro; and Designing High-Performance DIMM-in-a-Package On-Board Memory Modules, presented by Zhuowen Sun, Invensas.
Thursday, Sept. 12 includes sessions on I/O Optimization with Humair Mandavia, Zuken, Inc.; Trends in PCB and IC Packaging Substrates with Brandon Prior, Prismark Partners, LLC; Next-Generation OSP Technology with Michael Carano, OMG Electronic Chemicals; Polymer Challenges in 3-D integration, featuring Jeff Gotro, InnoCentrix; and the Future of Packaging for Computing Electronics, presented by Ram Viswanath, Intel.