Enthone recently published an Organic Solderability Preservative Performance Guide that enables OEMs, EMS, and printed circuit board fabricators to easily determine how yields, quality and reliability can be significantly increased throughout the supply chain, while dramatically reducing rework and rejects. Specifically, the guide provides compelling data comparing the industry’s leading Organic Solderability Preservative process, ENTEK® PLUS HT, with other established and black market alternatives.
As detailed in the guide, ENTEK PLUS HT delivers exceptional wetting capability by as much as 60% when compared with competitive Organic Solderability Preservatives. Furthermore, the wetting is faster with a substantially higher maximum force (mN/mm); both properties are industry accepted as being key indicators to providing enhanced copper protection and solderability. Additional test results on wave soldering hole fill performance, visual appearance after multiple lead-free reflows, ICT reliability and ball shear strength are also detailed within the guide.
Available in both English and Simplified Chinese, the ENTEK PLUS HT OSP Performance Guide may be requested by emailing email@example.com. To verify your Organic Solderability Preservative process, please visit http://enthone.com/ENTEK_PLUS_HT.
Enthone Inc., an Alent plc company, is a global and leading supplier of high-performance specialty chemicals and coatings. Enthone creates customer value by providing innovative and cost-effective technology solutions to the automotive, building hardware, energy, aerospace, jewelry, industrial finishes, printed circuit board and semiconductor industries. For more information, please visit enthone.com.