Special issue on Residual stress evaluation at the micro and nano scales: recent advancements of measurement techniques, validation through modelling and future challenges

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Assessment of residual stress with sub-micrometer resolution is of paramount importance for design and validation of advanced materials, applications including super-alloys, biomaterials, thin films and microelectronics devices. A number of recent developments have already taken place, opening the way for designing of novel nanostructured materials and micro-devices with tailored 3D residual stress distributions.

This special issue will present a unique collection with the most recent advances on development of novel high-resolution techniques for residual stress measurement on the micro and nano scales, including FIB-DIC methods, EBSD, micro-Raman Spectroscopy, nano-diffraction, etc.

The aim of this special issue of Materials & Design is thus to provide a collection of timely and high quality papers on novel advanced methods and challenging applications on micro/nano-scale residual stress assessment. This includes (but is not limited to):

•    Novel advanced methodologies for residual stress assessment at the micro and nano scales
•    Progress towards standardization of high resolution residual stress measurement techniques
•    Application of high resolution residual stress analysis to engineered nano-coatings and multilayered structures
•    Application of high resolution residual stress analysis to micro-electronics devices
•    Application of high resolution residual stress analysis on advanced polycrystalline alloys
•    Application of high resolution residual stress analysis on soft matter, biological tissues, biomaterials and composite materials

Guest editor biographies: 

Dr. Marco Sebastiani is currently an assistant professor of Materials Science at Roma TRE university (Rome). His research interests lie in advanced structural materials and thin films, novel nano-mechanical testing procedures for the assessment of mechanical properties and size effects by nanoindentation, and high-resolution residual stress assessment in nanostructured coatings and small-scale devices. Marco Sebastiani is Associate Editor of Materials & Design.

Prof. Alexander M. Korsunsky is currently Professor of Engineering Science at the University of Oxford and Fellow of Trinity College. He is a leading expert in the use of X-rays, neutrons, electron and ion beams and mechanical probes for engineering microscopy of materials and structures, and the optimisation of design, durability and performance. He heads Multi-Beam Laboratory for Engineering Microscopy (MBLEM) at Oxford, and the Centre for In situ Processing Science (CIPS) at Research Complex at Harwell. He consults Rolls-Royce plc on residual stress and structural integrity. Alexander M. Korsunsky is Editor-in-Chief of Materials & Design.

Dr. Tan Sui is currently Postdoctoral Researcher under EU FP7 collaborative research project iSTRESS on FIB-DIC residual stress analysis at the micro-nano-scale. She is Visiting Staff member at the Research Complex at Harwell, and College Tutor in Engineering Science at St Anne’s College, Oxford. Her research interests concern microstructural characterization and multi-scale modelling of thermo-mechanical behaviour of hierarchically structured materials and tissues using multi-modal X-ray techniques (Diffraction, Imaging and Spectroscopy), as well as multi-beam microscopy techniques (FIB, SEM, EDX, EBSD, STEM and TOF-SIMS). Tan Sui is Managing Editor of Materials & Design.