Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor. The scope of Thin Solid Films is indicated by, but not limited to, the following topical subheadings:

• A. Synthesis and Characterization
• B. Surfaces, Interfaces, and Colloidal Behaviour
• C. Metallurgical, Protective, and Hard Layers
• D. Mechanics and Nanomechanics of Thin Layers
• E. Electronics, Optics, and Opto-electronics
• F. Magnetics and Magneto-optics
• G. Superconductivity
• H. Langmuir—Blodgett, Biological, and Related Films
• I. Thin Film Devices, Sensors, and Actuators
• J. Condensed Matter Film Behaviour.

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Editorial board

Editor-in-Chief

  • J.E. Greene
    Frederick Seitz Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA

Associate Editors

  • D. Abou-Ras
    Helmholtz-Zentrum Berlin für Materialien und Energie, Berlin, Germany
  • Z.H. Barber
    Department of Materials Science and Metallurgy, University of Cambridge, Cambridge, UK
  • P. Desjardins
    Dépt. de Génie Physique, École Polytechnique de Montreal, Montréal, Quebec, Canada
  • T.A. Gessert
    Gessert Consulting, LLC, Conifer, Colorado, USA
  • C. S. Lee
    Dept. of Biology and Chemistry, City University of Hong Kong, Kowloon, Hong Kong

Editorial Board

  • T.L. Alford
    Dept. of Chemical & Materials Engineering, Arizona State University, Tempe, Arizona, USA
  • J.-M. Baribeau
    Inst. for Microstructural Sciences, Conseil national de recherches Canada (CNRC), Ottawa, Ontario, Canada
  • P.B. Barna
    Res. Inst. for Technical Physics HAS, Budapest, Hungary
  • J.P. Chu
    Dept. of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, Taiwan, ROC
  • M.-A. De Paoli
    Instituto de Química, Universidade Estadual de Campinas (UNICAMP), Campinas, Brazil
  • A. Djurisic
    The University of Hong Kong, Hong Kong, Hong Kong
  • D. Gall
    Materials Science & Engineering, MRC 204, Rensselaer Polytechnic Institute, Troy, New York, USA
  • C.G. Granqvist
    Dept. of Engineering Science (Inst. för Teknikvetenskaper), Uppsala Universitet, Uppsala, Sweden
  • H.J. Kim
    School of Electrical and Electronic Engineering, Yonsei University, Seodaemun-Gu, Seoul, The Republic of Korea
  • Y. Li
    Institute of Chemistry, Chinese Academy of Sciences (CAS), Beijing, China
  • P.J. Martin
    Materials Science & Engineering, CSIRO (The Commonwealth Scientific and Industrial Research Organization), Lindfield, New South Wales, Australia
  • A.K. Pal
    Dept. of Materials Science, Indian Association. for the Cultivation of Science, Jadavpur, Kolkata, India
  • J. Patscheider
    Materials Science and Technology, EMPA, Dübendorf, Switzerland
  • J.-J. Pireaux
    LISE Lab., Université de Namur, Namur, Belgium
  • B. Ratner
    Dept. of Bioengineering, University of Washington, Seattle, Washington, USA
  • I.K. Schuller
    Dept. of Physics, 0319, University of California at San Diego (UCSD), La Jolla, California, USA
  • J.A.N.T. Soares
    Materials Research Lab., University of Illinois at Urbana-Champaign, Urbana, Illinois, USA