Semiconductor packaging examples showing 3D Interconnects for 3D stacked die (left), mmWave (center), and flex circuit (right).
Semiconductor packaging examples showing 3D Interconnects for 3D stacked die (left), mmWave (center), and flex circuit (right).

Optomec has reported supplied five aerosol jet 3D electronics printers to an OEM manufacturer, bringing its total to 15 systems. According to the company, the $1+ million order is part of a production ramping up plan that will grow to more than 25 systems over the next 12 months.

Optomec’s patented printers can reportedly directly print high resolution conductive circuitry, with feature sizes as small as 10 microns. It can also print onto non-planar substrates and fully 3-dimensional end-parts, the company said.

Applications include direct printing of 3D antenna, 3D sensors, medical electronics, semiconductor packaging and display assembly.

This story uses material from Optomec, with editorial changes made by Materials Today.