Masterbond, which makes epoxies and adhesives amongst other materials, has developed Master Bond EP17HTDA-1, a one component epoxy that can also be used for bonding and sealing.

Master Bond says that EP17HTDA-1 does not require any mixing for use and is curable in the temperature range of 300-350°F in short durations. According to the company, it bonds well to composites as well as a wide variety of substrates, such as metals, ceramics and plastics.. Upon curing, it delivers a tensile lap shear strength of 2,400-2,600 psi and a tensile strength of 9,000-10,000 psi. It also has minimal shrinkage upon curing.

This system features an die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 has temperature resistance with a service temperature range of -80°F to +600°F [-62°C to +316°C] and a Tg of 195-205°C. It can withstand a variety of chemicals including acids, bases, salts, fuels, oils and many solvents.

‘EP17HTDA-1 has the ideal viscosity and flow for die attach applications,’ said Rohit Ramnath, senior product engineer. ‘It has a high glass transition temperature (Tg) and also offers excellent electrical insulation properties, even at elevated temperatures and low exotherm upon curing.’ 

This story is reprinted from material from Master Bondwith editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.