Master Bond, a specialist in epoxy adhesives, has developed EP30LTE-2 for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required.

EP30LTE-2 reportedly has low linear and volumetric shrinkage upon curing with a compressive strength of the cured material of 24,000-26,000 psi and CTE of 10-13 x 10-6/in/in/°C. It is a reliable electrical insulator featuring volume resistivity of more than 1015 ohm-cm. EP30LTE-2 meets NASA low outgassing specifications and features a combination of physical properties making it suitable for applications in aerospace, optical, electronic and specialty OEM industries where these requirements are critical.

EP30LTE-2 is a two part epoxy which obtains its best properties when cured overnight at room temperature followed by a heat cure for 2-4 hours at 150-200°F. This system offers moderate flow characteristics with a mixed viscosity ranging from 70,000 to 100,000 cps. In addition to standard packaging units of ½ pint, pint, quart, gallon and 5 gallon kits, the epoxy is available in premixed and frozen syringes.

This story uses material from Master Bond, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.