UK-based Applied Graphene Materials (AGM) has launched two thermal paste adhesive materials: Genable 4400 and Genable 4300. The new products are available as two-part epoxy systems in thermal management applications and are designed for use either directly as a paste adhesive and gap filler, or as potential base additives to enhance other formulated systems.

The two products have been formulated to deliver different level of processing viscosity to suit specific application requirements and can provide in-situ thermal conductivity in the region of 3-6 W/mK, with improve levels of lap shear strength, the company says.

AGM says that the adhesives are suitable for bonding, potting, sealing and encapsulation of space, electronics and automotive components.

This story is reprinted from material from AGMwith editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.