Hexion Inc says that it has developed a phenolic resin for prepreg composites with a free formaldehyde (ULEF) content of less than 0.1%.

The new, lower volatile organic compound (VOC) Cellobond J 6021X01 resins have been designed for prepreg manufacturing. The ULEF resin systems have 90% less free formaldehyde than previous systems. This new system helps reduce emissions during composite manufacturing and allows the development of prepreg composite systems with further reductions in free formaldehyde content.

‘Phenolic composites are universally accepted as the best option for meeting the most stringent fire safety standards, such as FAR 25.853,’ claimed Neil Smallwood, managing director at FTI Group. ‘With Cellobond J6021X01 phenolic resin, we have been able to combine fire safety with safer prepreg manufacturing and handling. Our new FibaRoll PH prepregs and SMC formulations have a residual free formaldehyde of <0.01%. FST results are excellent, with outstanding peak heat release of <10 kW/m2.’

This story is reprinted from material from Hexion, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.