Kirigami helps electronic circuits to bend and twist

Like a yoga novice, electronic components don't stretch easily. But that's changing thanks to a version of origami that involves cutting folded pieces of paper. In a study published in Advanced Materials, a University at Buffalo-led research team describes how kirigami has inspired its efforts to build malleable electronic circuits.

Their innovation – creating tiny sheets of strong yet bendable electronic materials made of select polymers and nanowires – could lead to improvements in smart clothing, electronic skin and other applications that require pliable circuitry.

"Traditional electronics, like the printed circuit boards in tablets and other electronic devices, are rigid. That's not a good match for the human body, which is full of bends and curves, especially when we are moving," explains lead author Shenqiang Ren, professor in the Department of Mechanical and Aerospace Engineering at the University at Buffalo.

"We examined the design principles behind kirigami, which is an efficient and beautiful art form, and applied them to our work to develop a much stronger and stretchable conductor of power," says Ren, also a member of the University at Buffalo's RENEW Institute, which is dedicated to solving complex environmental problems.

The study, which included computational modeling contributions from researchers at Temple University, employs nanoconfinement engineering and strain engineering (a strategy in semiconductor manufacturing used to boost device performance).

Without kirigami, the polymer – known as PthTFB – can be deformed up to 6% from its original shape without changing its electronic conductivity. With kirigami, the polymer can stretch up to 2000%. Also, the conductivity of PthTFB with kirigami increases by three orders of magnitude.

This advance has many potential applications, including in electronic skin (thin electronic material that mimics human skin, often used in robotic and health applications), bendable display screens and electronic paper. But its most useful application could be in smart clothing, a market that analysts say could reach $4 billion by 2024.

This story is adapted from material from the University at Buffalo, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier. Link to original source.