By Kari Williamson

The molybdenum-copper composite has a thermal conductivity of 170 W/mK and, with 6.7 ppm/K, the same coefficient of thermal expansion as sapphire (Al2O3), which is used in most common blue spectrum chips.

Plansee says it can supply the Mo-Cu wafer substrates with coatings made from nickel-gold, ruthenium, chromium, silver and other interface materials, protecting the wafer substrate against corrosion and optimising its surface properties for the subsequent bonding process.