The MPIF’s Technical Board has selected a paper to receive the 2015 MPIF Howard I. Sanderow Outstanding Technical Paper Award at the recent POWDERMET2015 show.

The paper, Liquid-Phase Diffusion Bonding: Temperature Effects and Solute Redistribution in High Temperature Lead-Free Composite Solders (pdf) was authored by Stephanie Choquette and Iver E. Anderson, FAPMI, Ames Laboratory (USDOE)/Iowa State University. It is one of 32 qualified manuscripts presented at the conference in San Diego, California, that were critically evaluated for the prestigious award.

The authors will receive their award plaques during POWDERMET2016 which takes place from 5–8 June, in Boston, Mass. The paper is published in the CD-ROM conference proceedings, Advances in Powder Metallurgy & Particulate Materials – 2015.

This story is reprinted from material from the MPIF, with editorial changes made by Materials Today. The views expressed in this article do not necessarily represent those of Elsevier.