Materials Today Physics is a multi-disciplinary journal that publishes high quality research and review papers dedicated to materials synthesis, physics, and applications. The special issue of “Soft Materials and Flexible Electronics” in Materials Today Physics creates a new platform which aims to address the key concerns on flexible and soft electronics, and offers new opportunities for human-machine interfaces, soft robotics, advanced healthcare, and internet of things. The key areas include interfacial effects between heterogeneous materials, design strategies from materials to devices to systems, manufacturing methods, applications, and physics that are related to flexible electronics and materials.
This special issue calls for cutting-edge and exciting research on physics, mechanics, manufacturing, materials, devices, and systems of flexible electronics and soft materials. Submissions will include but are not limited to:
- Materials for flexible electronics
- Actuation and sensing materials and devices
- Novel fabrication techniques for soft materials and flexible electronics
- Applications: displays, smart skin, health monitors, human-machine interfaces, medicine, etc.
- Human body technologies: wearables, implantables, epidermal electronics, and advanced healthcare systems
- Soft robotics, soft bionic devices and systems
- Mechanical and materials designs, interfaces, reliability, and fatigue
Submission guidelines: please go submission webpage https://www.elsevier.com/journals/materials-today-physics/2542-5293/guide-for-authors for author guidelines.
Manuscript submission due date: Feb. 28, 2020.
Guest Editors:
Prof. Chuanfei Guo, Southern University of Science and Technology, China.
Email: guocf@sustech.edu.cn
Prof. Xuanhe Zhao, Massachusetts Institute of Technology, USA
Email: zhaox@mit.edu
Prof. Zhigang Wu, Huazhong University of Science and Technology, China
Email: zgwu@hust.edu.cn
Prof. Cunjiang Yu, University of Houston, USA
Email: cyu15@uh.edu