Microelectronic Engineering has an open access mirror journal Micro and Nano Engineering, sharing the same aims and scope, editorial team, submission system and rigorous peer review.

Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.

The journal addresses the following topics and considers mostly experimental work, or theoretical / simulation work directly linked and supporting experiments in the fields:

  • Microelectronics processing & materials (Lithography, Self-assembly, Plasma Processing, Metallization, 3D Integration, Related Materials….)
  • Micro-/Nano-engineering / fabrication / technology / manufacturing
  • Nanoelectronic and photonic devices and their fabrication
  • Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
  • Microfluidics, life science devices /sensors, as well as integrated Lab-on-a-chip and their fabrication

In detail the topics covered are as follows:

1. Nanolithography and Nanopatterning:

  • Optical Lithography
  • Electron Optical Methods and Systems
  • X-ray Optical Methods and Systems
  • Resists
  • Limits of Nanolithography
  • Nanoimprint Lithography
  • EUV Lithography and Masks
  • Charged Particle Based Lithography and Patterning
  • Nanoimprint Lithography Techniques and Templates
  • Maskless Lithography
  • Emerging Nanopatterning Methods
  • Limits of Nanopatterning

2. Pattern Transfer

  • Ion Technology
  • Plasma Processing
  • Transfer of Pattern with Other Methods
  • Plasma Etching
  • Plasma Nanotechnology
  • Plasma / beam Nanopatterning
  • Plasma Surface Modification of Devices
  • Wet transfer methods

3. Materials

  • Metallization and Barrier Materials
  • Silicon on Insulators
  • Dielectrics (low K and high K)
  • Interconnects
  • New Resist Materials
  • Nanomaterials for Device Fabrication
  • Block Copolymers
  • Polymers and Flexible Substrates
  • Layered (2D) Materials and Related Transferring Techniques

4. Nanometrology, Inspection and Testing

  • Electron Beam Testers
  • Laser Probes
  • Signal and Image Processing
  • Nanometrology
  • AFM and Scanning Probe Measurements

5. Advanced Processing and Nanofabrication

  • Process Integration
  • Three Dimensional Integration
  • Other / Emerging Manufacturing and Fabrication Techniques
  • 3D Printing
  • Rapid Thermal Processing
  • Process Modelling and Simulation
  • Equipment Modelling
  • Laser Assisted Processing
  • Top-Down / Bottom-Up (Self-Assembly) Nanofabrication
  • Growth, Planarization, Cleaning Techniques for Devices
    • Plasma deposition
    • MBE
    • Other growth techniques
    • Planarization and cleaning techniques

6. Advanced Nanoelectronic, Photonic, Sensing, Energy Harvesting, and Fluidic Devices

  • Nanoelectronic, Optoelectronic and Photonic Devices
    • Memristive devices for neuromorphic computing
    • Steep slope or fast switching devices
    • Photonic devices
    • Optoelectronic devices

  • Dimension-sensitive Device Properties
  • Memory Devices

    • Magnetic and spintronic devices

  • Advanced MOS Devices
  • Vacuum Nanoelectronics
  • Flexible / Organic / Molecular Electronics

    • Organic and molecular electronics
    • Flexible electronics
    • Wearable electronics
    • Paper electronics
    • Printed electronics

  • Microdevices, Energy Harvesting Devices and Sensors

    • Physical sensors and actuators
    • Energy harvesting devices

7. Chemical, biological, bioelectronic and fluidic devices. Heterogeneous Micro-Nano and Bio Systems

  • Electro-Mechanical Systems (MEMS, NEMS)
  • Power MEMS
  • RF MEMS
  • MOEMS
  • Magnetic MEMS
  • Optical and Photonic Systems

  • Micro and Nano Fluidic Devices
  • Pumping / valving devices
  • Mixing devices
  • Separation devices
  • Microreactors
  • Sample preparation devices
  • Fluidic interfaces and integration

  • Miniaturized Devices for Biology, Chemistry, Medicine
  • Biosensors
  • Chemical sensors
  • Biomimetic properties incorporated into devices
  • Bioelectronic devices
  • Micro / nano / bio interface and interconnection devices

  • Lab-on-a-chip, bioMEMS, microTAS
  • DNA / protein chips
  • Cell on chip
  • Organ on chip
  • Biomimetic properties incorporated into systems
  • Bioanalytic, diagnostic systems
  • Microseparation, pretreatment systems
  • On-chip detection systems
  • Environmental and food monitoring systems
  • Microreactors

Manuscripts of 5 (five) types are considered:

  • Review Articles that inform readers of the latest research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications (authors should e-mail editors with a review proposal and outline before submitting)
  • Accelerated Publications (Letters) that feature exciting research breakthroughs in the field
  • Regular original research papers
  • Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development work
  • News and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work

Editorial board

Editor-in-Chief

  • Dr. Evangelos Gogolides
    Institute of Nanoscience and Nanotechnology, Aghia Paraskevi, 15310, Athens, Greece

Editor Special Issues

  • Dr. Jin-Woo Choi
    Louisiana State University, Baton Rouge, Louisiana, United States

Area Editors

  • Dr. Joel Barnett
    Tokyo Electron US Holdings Inc, Austin Texas, , United States
  • Professor Ahmed Busnaina
    Northeastern University (NU), Nanomanufacturing and the NSF Center for Microcontamination Control, 467 Egan Bldg, Boston, Massachusetts, MA 02115, United States
  • Dr. Yifang Chen
    Fudan University, School of Information Science and Engineering, 220 Han Dan Road, 200433, Shanghai, China
  • Dr. Vassilios Constantoudis
    Institute of Nanoscience and Nanotechnology, Aghia Paraskevi, 15310, Athens, Greece
  • Dr. Uros Cvelbar
    Jozef Stefan Institute, 1000, Ljubljana, Slovenia
  • Dr. Wim De Malsche
    VUB University, 1050, Brussel, Belgium
  • Dr. Jean Francois de Marneffe
    Interuniversity Micro-Electronic Centre, 3001, Leuven, Belgium
  • Professor Huigao Duan
    Hunan University College of Mechanical and Vehicle Engineering, College of Mechanical and Vehicle Engineering, Hunan University, 410082, Changsha, Hunan, China
  • Professor Chien-Chong Hong
    National Tsing Hua University Department of Power Mechanical Engineering, No. 101, Section 2, Kuang-Fu Road, 30013, Hsinchu, Taiwan
  • Professor Dong Sung Kim
    Pohang University of Science and Technology Department of Mechanical Engineering, 77 Cheongam-Ro, Nam-Gu, 37673, Pohang, South Korea
  • Dr. Mario Lanza
    Soochow University, Institute of Functional Nano & Soft Materials, Suzhou, China
  • Dr. Jaejong Lee
    Korea Institute of Machinery and Materials, Nano-Convergence Mechanical Systems Research Division, 156 Gajeongbuk-Ro, 305-343, Yusong, Daejeon, Korea, Republic of
  • Dr. Sangho Lee
    Korea Insitiute of Industrial Technology, Ansan-si, Republic of Korea
  • Professor Wu LU
    Ohio State University Department of Electrical and Computer Engineering, 205 Dreese Labs; 2015 Neil Avenue, Columbus Ohio, 43210, United States
  • Dr. Rodolphe Marie
    Danmarks Tekniske Universitet (DTU), DTU Nanotech
  • Dr. Sunggook Park
    Louisiana State University, Mechanical & Industrial Engineering Department, 2514B Patrick F. Taylor Hall, Baton Rouge, Louisiana, 70803, United States
  • Dr. Edward Song
    University of New Hampshire, Department of Electrical and Computer Engineering, Durham, NH 03824, United States
  • Professor Li Tao
    Southeast University, School of Material Science and Engineering, Jiangsu China
  • Dr. Guillermo Villanueva
    École Polytechnique Fédérale de Lausanne (EPFL), STI-IGM NEMS, ME D2 2726 - Station 9, CH-1015, Lausanne, Switzerland
  • Prof. Dr. Shaowei Wang
    Shanghai Institute of Technical Physics Chinese Academy of Sciences, 188 Xinlai Rd, Jiading Qu, 201815, Shanghai Shi China

Advisory Editors, Europe

  • Professor Nuria Barniol
    Autonomous University of Barcelona, Barcelona, Spain
  • Professor Joan Bausells
    Institute of Microelectronics of Barcelona IMB-CNM-CSIC, National Microelectronics Center (CNM), Bellaterra (Barcelona), Spain
  • Dr. Holger Becker
    Microfluidic ChipShop GmbH, Jena, Germany
  • Dr. Hubert Brückl
    Donau-Universitat Krems, Center for Integrated Sensor Systems, Wiener Neustadt, Austria
  • Dr. Yong Chen
    University College Paris, Paris, France
  • Dr. Michel Despont
    Centre Suisse d'Electronique et de Microtechnique (CSEM), Zurich, Switzerland
  • Professor Massimo De Vittorio
    University of Salento, Lecce, Italy
  • Dr. Athanasios Dimoulas
    Ethniko Kentro Ereunas Physikon Epistemon 'Demokritos', Athens, Greece
  • Dr. Zahid A. K. Durrani
    Imperial College London, London, United Kingdom
  • Dr. Thomas Ernst
    French Alternative Energies and Atomic Energy Commission Electronics and Information Technology Laboratory, Grenoble, France
  • Dr. Maria Farsari
    Foundation of Research and Technology Hellas Library, Irakleio, Greece
  • Dr. Guglielmo Fortunato
    Consiglio Nazionale delle Ricerche (CNR), Institute for Microelectronics and Microsystems, Catania, Italy
  • Dr. Nikolaj Gadegaard
    University of Glasgow, Glasgow, United Kingdom
  • Dr. Jim Greer
    University College Cork National University of Ireland, Cork, Ireland
  • Dr. Cornelis Wouter Hagen
    TU Delft, Delft, Netherlands
  • Dr. Mervyn E. Jones
    Imperial College London, London, United Kingdom
  • Professor Dieter Kern
    Eberhard Karls University Tübingen, Tubingen, Germany
  • Dr. Salvo Mirabella
    University of Catania, Catania, Italy
  • Dr. Fransesc Pérez-Murano
    Universitat Autònoma de Barcelona (UAB), Instituto de Microelectrónica de Barcelona, Bellaterra, Spain
  • Dr. David Peyrade
    Microelectronic Technology Laboratory, Grenoble, France
  • Dr. Ivo Rangelow
    Ilmenau University of Technology, Ilmenau, Germany
  • Dr. Helmut Schift
    Paul Scherrer Institute, Villigen, Switzerland
  • Prof. Dr. Urs Staufer
    TU Delft, Delft, Netherlands
  • Dr. Maria Tenje
    Uppsala University, Uppsala, Sweden
  • Prof. Dr. Dimitris Tsoukalas
    National Technical University of Athens, Athens, Greece
  • Dr. Christophe Vieu
    Toulouse School of Engineering, Toulouse, France

Advisory Editors, America

  • Dr. Mohamed Chaker
    Institut National de la Recherche Scientifique (INRS), Varennes, Quebec, Canada
  • Dr. Maxime Darnon
    University of Sherbrooke, Sherbrooke, Quebec, Canada
  • Dr. Panos Datskos
    Oak Ridge National Laboratory, Oak Ridge, Tennessee, United States
  • Professor Demetre Economou
    University of Houston, Houston, Texas, United States
  • Dr. Stephane Evoy
    University of Alberta, Edmonton, Alberta, Canada
  • Dr. Gregg Gallatin
    Applied Math Solutions, Newtown, Connecticut, United States
  • Mr. John Hartley
    Nuflare Technology USA, Hopewell Junction, New York, United States
  • Dr. Patrick Naulleau
    E O Lawrence Berkeley National Laboratory, Berkeley, California, United States
  • Professor Ian Papautsky
    University of Illinois at Chicago, Chicago, Illinois, United States
  • Professor Kimberly Turner
    University of California Santa Barbara, Santa Barbara, California, United States
  • Professor Joseph Wang
    University of California San Diego, La Jolla, California, United States

Advisory Editors, Asia-Oceania

  • Dr. Maan Alkaisi
    University of Canterbury, Christchurch, New Zealand
  • Dr. Hsuen-Li Chen
    National Taiwan University, Taipei, Taiwan
  • Dr. Toshiaki Iwamatsu
    Renesas Technology Corporation, Dept. of Advanced Device Development, Itami, Japan
  • Professor Beomjoon Kim
    The University of Tokyo, Bunkyo-Ku, Tokyo, Japan
  • Dr. Ran Liu
    Fudan University, Shanghai, China
  • Professor Hidenori Mimura
    Shizuoka University Research Institute of Electronics, Hamamatsu, Japan
  • Dr. Jeroen Van Kan
    National University of Singapore, Singapore, Singapore
  • Professor Dacheng Wei
    Fudan University, Shanghai, China
  • Professor Sheng-Joue Young
    National Formosa University, Huwei, Taiwan