Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.

The journal addresses the following topics and considers mostly experimental work, or theoretical / simulation work directly linked and supporting experiments in the fields:

  • Microelectronics processing & materials (Lithography, Self-assembly, Plasma Processing, Metallization, 3D Integration, Related Materials….)
  • Micro-/Nano-engineering / fabrication / technology / manufacturing
  • Nanoelectronic and photonic devices and their fabrication
  • Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
  • Microfluidics, life science devices /sensors, as well as integrated Lab-on-a-chip and their fabrication

In detail the topics covered are as follows:

1. Nanolithography and Nanopatterning:

  • Optical Lithography
  • Electron Optical Methods and Systems
  • X-ray Optical Methods and Systems
  • Resists
  • Limits of Nanolithography
  • Nanoimprint Lithography
  • EUV Lithography and Masks
  • Charged Particle Based Lithography and Patterning
  • Nanoimprint Lithography Techniques and Templates
  • Maskless Lithography
  • Emerging Nanopatterning Methods
  • Limits of Nanopatterning

2. Pattern Transfer

  • Ion Technology
  • Plasma Processing
  • Transfer of Pattern with Other Methods
  • Plasma Etching
  • Plasma Nanotechnology
  • Plasma / beam Nanopatterning
  • Plasma Surface Modification of Devices
  • Wet transfer methods

3. Materials

  • Metallization and Barrier Materials
  • Silicon on Insulators
  • Dielectrics (low K and high K)
  • Interconnects
  • New Resist Materials
  • Nanomaterials for Device Fabrication
  • Block Copolymers
  • Polymers and Flexible Substrates
  • Layered (2D) Materials and Related Transferring Techniques

4. Nanometrology, Inspection and Testing

  • Electron Beam Testers
  • Laser Probes
  • Signal and Image Processing
  • Nanometrology
  • AFM and Scanning Probe Measurements

5. Advanced Processing and Nanofabrication

  • Process Integration
  • Three Dimensional Integration
  • Other / Emerging Manufacturing and Fabrication Techniques
  • 3D Printing
  • Rapid Thermal Processing
  • Process Modelling and Simulation
  • Equipment Modelling
  • Laser Assisted Processing
  • Top-Down / Bottom-Up (Self-Assembly) Nanofabrication
  • Growth, Planarization, Cleaning Techniques for Devices
    • Plasma deposition
    • MBE
    • Other growth techniques
    • Planarization and cleaning techniques

6. Advanced Nanoelectronic, Photonic, Sensing, Energy Harvesting, and Fluidic Devices

  • Nanoelectronic, Optoelectronic and Photonic Devices
    • Memristive devices for neuromorphic computing
    • Steep slope or fast switching devices
    • Photonic devices
    • Optoelectronic devices

  • Dimension-sensitive Device Properties
  • Memory Devices

    • Magnetic and spintronic devices

  • Advanced MOS Devices
  • Vacuum Nanoelectronics
  • Flexible / Organic / Molecular Electronics

    • Organic and molecular electronics
    • Flexible electronics
    • Wearable electronics
    • Paper electronics
    • Printed electronics

  • Microdevices, Energy Harvesting Devices and Sensors

    • Physical sensors and actuators
    • Energy harvesting devices

  • Micro- & Nanofluidics

    • Valving devices
    • Pumping devices
    • Mixing devices
    • Separation devices

  • Other Miniaturized Devices for Biology, Chemistry, and Medicine (sensors and biosensors)

    • Biosensors
    • Chemical sensors
    • Biomimetic properties incorporated into devices
    • Bioelectronic devices
    • Micro / nano / bio interface and interconnection devices

7. Advanced Fabrication and Characterization for heterogeneous Micro and Nano Systems

  • Electro-Mechanical Systems (MEMS, NEMS)
    • Power MEMS
    • RF MEMS
    • MOEMS
    • Magnetic MEMS

  • Optical and Photonic Systems
  • Fluidic Systems

    • Pumping / valving systems
    • Microreactors
    • Fluidic interfaces and integration

  • Biosystems

    • DNA / protein chips
    • Cell on chip
    • Organ on chip
    • Biomimetic properties incorporated into systems

  • Lab-on-a-Chip / μ-TAS

    • Bioanalytic, diagnostic systems
    • Microseparation, pretreatment systems
    • On-chip detection systems
    • Environmental and food monitoring systems

Manuscripts of 5 (five) types are considered:

  • Review Articles that inform readers of the latest research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications (authors should e-mail editors with a review proposal and outline before submitting)
  • Accelerated Publications (Letters) that feature exciting research breakthroughs in the field
  • Regular original research papers
  • Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development work
  • News and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work

Editorial board

Editor-in-Chief, Europe

  • E. Gogolides
    Institute of Nanoscience and Nanotechnology, NCSR Demokritos

Editor Accelerated Publications

  • G. Villanueva
    École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland

Editor Special Issues

  • J.-W. Choi
    Louisiana State University, Baton Rouge, Louisiana, USA

Editor, Asia-Oceania

  • Y. Chen
    School of Information Science and Engineering, Fudan University, 220 Han Dan Road, 200433, Shanghai, China

Editor, America

  • A. Busnaina
    Northeastern University, USA

Advisory Editors, Europe

  • N. Barniol
    Universitat Autònoma de Barcelona (UAB), Spain
  • J. Bausells
    Institute of Microelectronics of Barcelona IMB-CNM-CSIC, Bellaterra (Barcelona), Spain
  • H. Becker
    microfluidic ChipShop GmbH, Jena, Germany
  • H. Brückl
    Donau-Universitat Krems, Wiener Neustadt, Austria
  • Y. Chen
    École Normale Supérieure, Paris, France
  • J.F. de Marneffe
    IMEC, Belgium
  • M. De Vittorio
    University of Salento, Lecce, Italy
  • M. Despont
    Centre Suisse d'Electronique et de Microtechnique (CSEM)
  • A. Dimoulas
    National Centre for Scientific Research "Demokritos", Aghia Paraskevi, Athens, Greece
  • Z.A.K. Durrani
    Imperial College London, London, England, UK
  • T. Ernst
    LETI CEA, Grenoble Cedex, France
  • M. Farsari
    Foundation for Research and Technology-Hellas, Heraklion, Crete, Greece
  • G. Fortunato
    Consiglio Nazionale delle Ricerche (CNR), Catania, Italy
  • N. Gadegaard
    University of Glasgow, Glasgow, Scotland, UK
  • J. Greer
    University College Cork, Cork, Ireland
  • C.W. Hagen
    Delft University of Technology, Delft, Netherlands
  • M.E. Jones
    Imperial College London, London, England, UK
  • D. Kern
    Eberhard-Karls-Universität Tübingen, Tübingen, Germany
  • S. Mirabella
    Università di Catania, Catania, Italy
  • F. Pérez-Murano
    Universitat Autònoma de Barcelona (UAB), Bellaterra, Spain
  • D. Peyrade
    Laboratoire des technologies de la Microélectronique, Grenoble, France
  • I.W. Rangelow
    Technische Universität Ilmenau, Ilmenau, Germany
  • H. Schift
    Paul Scherrer Institut (PSI), Villigen, Switzerland
  • U.S. Staufer
    Delft University of Technology, Delft, Netherlands
  • M. Tenje
    Uppsala University
  • D. Tsoukalas
    National Technical University of Athens (NTUA), Greece
  • C. Vieu
    Université de Toulouse, Toulouse, France

Advisory Editors, America

  • M. Chaker
    Institut National de la Recherche Scientifique (INRS), Varennes, Quebec, Canada
  • M. Darnon
    Université de Sherbrooke, Sherbrooke, Quebec, Canada
  • P. Datskos
    Oak Ridge National Laboratory, Oak Ridge, Tennessee, USA
  • D. Economou
    University of Houston, Houston, Texas, USA
  • S. Evoy
    University of Alberta, Edmonton, Alberta, Canada
  • G. M. Gallatin
    Applied Math Solutions, Newtown, Connecticut, USA
  • J. Hartley
    Nuflare Technology USA, Hopewell Junction, New York, USA
  • P. Naulleau
    Lawrence Berkeley National Laboratory, Berkeley, California, USA
  • T. Nigam
  • I. Papautsky
    University of Illinois at Chicago
  • Sunggook Park
    Louisiana State University, Baton Rouge, Louisiana, USA
  • K. L. Turner
    University of California at Santa Barbara, Santa Barbara, USA
  • J. Wang
    University of California at San Diego (UCSD), La Jolla, San Diego, California, USA

Advisory Editors, Asia-Oceania

  • M. Alkaisi
    University of Canterbury, Christchurch, New Zealand
  • H. Chen
    National Taiwan University, Taipei, Taiwan
  • T. Iwamatsu
    Renesas Technology Corporation, Itami, Japan
  • B. Kim
    The University of Tokyo, Tokyo, Japan
  • J. Lee
    Korea Institute of Machinery and Materials, Yusong, Daejeon, The Republic of Korea
  • R. Liu
    Fudan University, Shanghai, China
  • H. Mimura
    Shizuoka University, Hamamatsu, Japan
  • J Van Kan
    National University of Singapore, Singapore, Singapore
  • D. Wei
    Fudan University, Shanghai, China
  • S.J. Young
    National Formosa University, Huwei Township, Yunlin County, Taiwan