Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
The journal addresses the following topics and considers mostly experimental work, or theoretical / simulation work directly linked and supporting experiments in the fields:
- Microelectronics processing & materials (Lithography, Self-assembly, Plasma Processing, Metallization, 3D Integration, Related Materials….)
- Micro-/Nano-engineering / fabrication / technology / manufacturing
- Nanoelectronic and photonic devices and their fabrication
- Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
- Microfluidics, life science devices /sensors, as well as integrated Lab-on-a-chip and their fabrication
In detail the topics covered are as follows:
1. Nanolithography and Nanopatterning:
- Optical Lithography
- Electron Optical Methods and Systems
- X-ray Optical Methods and Systems
- Resists
- Limits of Nanolithography
- Nanoimprint Lithography
- EUV Lithography and Masks
- Charged Particle Based Lithography and Patterning
- Nanoimprint Lithography Techniques and Templates
- Maskless Lithography
- Emerging Nanopatterning Methods
- Limits of Nanopatterning
2. Pattern Transfer
- Ion Technology
- Plasma Processing
- Transfer of Pattern with Other Methods
- Plasma Etching
- Plasma Nanotechnology
- Plasma / beam Nanopatterning
- Plasma Surface Modification of Devices
- Wet transfer methods
3. Materials
- Metallization and Barrier Materials
- Silicon on Insulators
- Dielectrics (low K and high K)
- Interconnects
- New Resist Materials
- Nanomaterials for Device Fabrication
- Block Copolymers
- Polymers and Flexible Substrates
- Layered (2D) Materials and Related Transferring Techniques
4. Nanometrology, Inspection and Testing
- Electron Beam Testers
- Laser Probes
- Signal and Image Processing
- Nanometrology
- AFM and Scanning Probe Measurements
5. Advanced Processing and Nanofabrication
- Process Integration
- Three Dimensional Integration
- Other / Emerging Manufacturing and Fabrication Techniques
- 3D Printing
- Rapid Thermal Processing
- Process Modelling and Simulation
- Equipment Modelling
- Laser Assisted Processing
- Top-Down / Bottom-Up (Self-Assembly) Nanofabrication
- Growth, Planarization, Cleaning Techniques for Devices
- Plasma deposition
- MBE
- Other growth techniques
- Planarization and cleaning techniques
6. Advanced Nanoelectronic, Photonic, Sensing, Energy Harvesting, and Fluidic Devices
- Nanoelectronic, Optoelectronic and Photonic Devices
- Memristive devices for neuromorphic computing
- Steep slope or fast switching devices
- Photonic devices
- Optoelectronic devices
- Dimension-sensitive Device Properties
- Memory Devices
- Magnetic and spintronic devices
- Advanced MOS Devices
- Vacuum Nanoelectronics
- Flexible / Organic / Molecular Electronics
- Organic and molecular electronics
- Flexible electronics
- Wearable electronics
- Paper electronics
- Printed electronics
- Microdevices, Energy Harvesting Devices and Sensors
- Physical sensors and actuators
- Energy harvesting devices
- Micro- & Nanofluidics
- Valving devices
- Pumping devices
- Mixing devices
- Separation devices
- Other Miniaturized Devices for Biology, Chemistry, and Medicine (sensors and biosensors)
- Biosensors
- Chemical sensors
- Biomimetic properties incorporated into devices
- Bioelectronic devices
- Micro / nano / bio interface and interconnection devices
7. Advanced Fabrication and Characterization for heterogeneous Micro and Nano Systems
- Electro-Mechanical Systems (MEMS, NEMS)
- Power MEMS
- RF MEMS
- MOEMS
- Magnetic MEMS
- Optical and Photonic Systems
- Fluidic Systems
- Pumping / valving systems
- Microreactors
- Fluidic interfaces and integration
- Biosystems
- DNA / protein chips
- Cell on chip
- Organ on chip
- Biomimetic properties incorporated into systems
- Lab-on-a-Chip / μ-TAS
- Bioanalytic, diagnostic systems
- Microseparation, pretreatment systems
- On-chip detection systems
- Environmental and food monitoring systems
Manuscripts of 5 (five) types are considered:
- Review Articles that inform readers of the latest research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications (authors should e-mail editors with a review proposal and outline before submitting)
- Accelerated Publications (Letters) that feature exciting research breakthroughs in the field
- Regular original research papers
- Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development work
- News and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work
Editorial board
Editor-in-Chief, Europe
- E. Gogolides
Institute of Nanoscience and Nanotechnology, NCSR Demokritos
Editor Accelerated Publications
- G. Villanueva
École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
Editor Special Issues
- J.-W. Choi
Louisiana State University, Baton Rouge, Louisiana, USA
Editor, Asia-Oceania
- Y. Chen
School of Information Science and Engineering, Fudan University, 220 Han Dan Road, 200433, Shanghai, China
Editor, America
- A. Busnaina
Northeastern University, USA
Advisory Editors, Europe
- N. Barniol
Universitat Autònoma de Barcelona (UAB), Spain - J. Bausells
Institute of Microelectronics of Barcelona IMB-CNM-CSIC, Bellaterra (Barcelona), Spain - H. Becker
microfluidic ChipShop GmbH, Jena, Germany - H. Brückl
Donau-Universitat Krems, Wiener Neustadt, Austria - Y. Chen
École Normale Supérieure, Paris, France - J.F. de Marneffe
IMEC, Belgium - M. De Vittorio
University of Salento, Lecce, Italy - M. Despont
Centre Suisse d'Electronique et de Microtechnique (CSEM) - A. Dimoulas
National Centre for Scientific Research "Demokritos", Aghia Paraskevi, Athens, Greece - Z.A.K. Durrani
Imperial College London, London, England, UK - T. Ernst
LETI CEA, Grenoble Cedex, France - M. Farsari
Foundation for Research and Technology-Hellas, Heraklion, Crete, Greece - G. Fortunato
Consiglio Nazionale delle Ricerche (CNR), Catania, Italy - N. Gadegaard
University of Glasgow, Glasgow, Scotland, UK - J. Greer
University College Cork, Cork, Ireland - C.W. Hagen
Delft University of Technology, Delft, Netherlands - M.E. Jones
Imperial College London, London, England, UK - D. Kern
Eberhard-Karls-Universität Tübingen, Tübingen, Germany - S. Mirabella
Università di Catania, Catania, Italy - F. Pérez-Murano
Universitat Autònoma de Barcelona (UAB), Bellaterra, Spain - D. Peyrade
Laboratoire des technologies de la Microélectronique, Grenoble, France - I.W. Rangelow
Technische Universität Ilmenau, Ilmenau, Germany - H. Schift
Paul Scherrer Institut (PSI), Villigen, Switzerland - U.S. Staufer
Delft University of Technology, Delft, Netherlands - M. Tenje
Uppsala University - D. Tsoukalas
National Technical University of Athens (NTUA), Greece - C. Vieu
Université de Toulouse, Toulouse, France
Advisory Editors, America
- M. Chaker
Institut National de la Recherche Scientifique (INRS), Varennes, Quebec, Canada - M. Darnon
Université de Sherbrooke, Sherbrooke, Quebec, Canada - P. Datskos
Oak Ridge National Laboratory, Oak Ridge, Tennessee, USA - D. Economou
University of Houston, Houston, Texas, USA - S. Evoy
University of Alberta, Edmonton, Alberta, Canada - G. M. Gallatin
Applied Math Solutions, Newtown, Connecticut, USA - J. Hartley
Nuflare Technology USA, Hopewell Junction, New York, USA - P. Naulleau
Lawrence Berkeley National Laboratory, Berkeley, California, USA - T. Nigam
- I. Papautsky
University of Illinois at Chicago - Sunggook Park
Louisiana State University, Baton Rouge, Louisiana, USA - K. L. Turner
University of California at Santa Barbara, Santa Barbara, USA - J. Wang
University of California at San Diego (UCSD), La Jolla, San Diego, California, USA
Advisory Editors, Asia-Oceania
- M. Alkaisi
University of Canterbury, Christchurch, New Zealand - H. Chen
National Taiwan University, Taipei, Taiwan - T. Iwamatsu
Renesas Technology Corporation, Itami, Japan - B. Kim
University of Tokyo, Tokyo, Japan - J. Lee
Korea Institute of Machinery and Materials, Yusong, Daejeon, The Republic of Korea - R. Liu
Fudan University, Shanghai, China - H. Mimura
Shizuoka University, Hamamatsu, Japan - J Van Kan
National University of Singapore, Singapore, Singapore - D. Wei
Fudan University, Shanghai, China - S.J. Young
National Formosa University, Huwei Township, Yunlin County, Taiwan