Microelectronic Engineering has an open access mirror journal Micro and Nano Engineering, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
The journal addresses the following topics and considers mostly experimental work, or theoretical / simulation work directly linked and supporting experiments in the fields:
- Microelectronics processing & materials (Lithography, Self-assembly, Plasma Processing, Metallization, 3D Integration, Related Materials….)
- Micro-/Nano-engineering / fabrication / technology / manufacturing
- Nanoelectronic and photonic devices and their fabrication
- Microsystems, microdevices (e.g., sensors and nanoenergy devices) and their fabrication
- Microfluidics, life science devices /sensors, as well as integrated Lab-on-a-chip and their fabrication
In detail the topics covered are as follows:
1. Nanolithography and Nanopatterning:
- Optical Lithography
- Electron Optical Methods and Systems
- X-ray Optical Methods and Systems
- Resists
- Limits of Nanolithography
- Nanoimprint Lithography
- EUV Lithography and Masks
- Charged Particle Based Lithography and Patterning
- Nanoimprint Lithography Techniques and Templates
- Maskless Lithography
- Emerging Nanopatterning Methods
- Limits of Nanopatterning
2. Pattern Transfer
- Ion Technology
- Plasma Processing
- Transfer of Pattern with Other Methods
- Plasma Etching
- Plasma Nanotechnology
- Plasma / beam Nanopatterning
- Plasma Surface Modification of Devices
- Wet transfer methods
3. Materials
- Metallization and Barrier Materials
- Silicon on Insulators
- Dielectrics (low K and high K)
- Interconnects
- New Resist Materials
- Nanomaterials for Device Fabrication
- Block Copolymers
- Polymers and Flexible Substrates
- Layered (2D) Materials and Related Transferring Techniques
4. Nanometrology, Inspection and Testing
- Electron Beam Testers
- Laser Probes
- Signal and Image Processing
- Nanometrology
- AFM and Scanning Probe Measurements
5. Advanced Processing and Nanofabrication
- Process Integration
- Three Dimensional Integration
- Other / Emerging Manufacturing and Fabrication Techniques
- 3D Printing
- Rapid Thermal Processing
- Process Modelling and Simulation
- Equipment Modelling
- Laser Assisted Processing
- Top-Down / Bottom-Up (Self-Assembly) Nanofabrication
- Growth, Planarization, Cleaning Techniques for Devices
- Plasma deposition
- MBE
- Other growth techniques
- Planarization and cleaning techniques
6. Advanced Nanoelectronic, Photonic, Sensing, Energy Harvesting, and Fluidic Devices
- Nanoelectronic, Optoelectronic and Photonic Devices
- Memristive devices for neuromorphic computing
- Steep slope or fast switching devices
- Photonic devices
- Optoelectronic devices
- Dimension-sensitive Device Properties
- Memory Devices
- Magnetic and spintronic devices
- Advanced MOS Devices
- Vacuum Nanoelectronics
- Flexible / Organic / Molecular Electronics
- Organic and molecular electronics
- Flexible electronics
- Wearable electronics
- Paper electronics
- Printed electronics
- Microdevices, Energy Harvesting Devices and Sensors
- Physical sensors and actuators
- Energy harvesting devices
7. Chemical, biological, bioelectronic and fluidic devices. Heterogeneous Micro-Nano and Bio Systems
- Electro-Mechanical Systems (MEMS, NEMS)
- Power MEMS
- RF MEMS
- MOEMS
- Magnetic MEMS
- Optical and Photonic Systems
- Micro and Nano Fluidic Devices
- Pumping / valving devices
- Mixing devices
- Separation devices
- Microreactors
- Sample preparation devices
- Fluidic interfaces and integration
- Miniaturized Devices for Biology, Chemistry, Medicine
- Biosensors
- Chemical sensors
- Biomimetic properties incorporated into devices
- Bioelectronic devices
- Micro / nano / bio interface and interconnection devices
- Lab-on-a-chip, bioMEMS, microTAS
- DNA / protein chips
- Cell on chip
- Organ on chip
- Biomimetic properties incorporated into systems
- Bioanalytic, diagnostic systems
- Microseparation, pretreatment systems
- On-chip detection systems
- Environmental and food monitoring systems
- Microreactors
Manuscripts of 5 (five) types are considered:
- Review Articles that inform readers of the latest research and advances in nanoelectronics, nanofabrication, micro-nano systems, and applications (authors should e-mail editors with a review proposal and outline before submitting)
- Accelerated Publications (Letters) that feature exciting research breakthroughs in the field
- Regular original research papers
- Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development work
- News and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work
Editorial board
Editor-in-Chief
- Dr. Evangelos Gogolides
Institute of Nanoscience and Nanotechnology, Aghia Paraskevi, 15310, Athens, Greece
Editor Special Issues
- Dr. Jin-Woo Choi
Louisiana State University, Baton Rouge, Louisiana, United States
Area Editors
- Dr. Maan Alkaisi
University of Canterbury, 8140, Christchurch, New Zealand - Dr. Joel M. Barnett
Tokyo Electron US Holdings Inc, Austin, Texas, , United States - Professor Joan Bausells
National Centre of Microelectronics, 08193, Bellaterra, Spain - Professor Ahmed Busnaina
Northeastern University Center for High-rate Nanomanufacturing, 467 Egan Bldg, Boston, Massachusetts, MA 02115, United States - Dr. Yifang Chen
Fudan University School of Information Science and Engineering, 220 Han Dan Road, 200433, Shanghai, China - Dr. Vassilios Constantoudis
Institute of Nanoscience and Nanotechnology, Aghia Paraskevi, 15310, Athens, Greece - Dr. Uros Cvelbar
Jozef Stefan Institute, 1000, Ljubljana, Slovenia - Dr. Maxime Darnon
University of Sherbrooke, Sherbrooke, J1K 2R1, Quebec, Canada - Dr. Wim De Malsche
VUB University, 1050, Brussel, Belgium - Dr. Christophe Detavernier
Ghent University, 9000, Gent, Belgium - Dr. Athanasios Dimoulas
Ethniko Kentro Ereunas Physikon Epistemon 'Demokritos', 153 10, Athens, Greece - Professor Huigao Duan
Hunan University College of Mechanical and Vehicle Engineering, College of Mechanical and Vehicle Engineering, Hunan University, 410082, Changsha, Hunan, China - Dr. Irene Fernandez-Cuesta
University of Hamburg, 20148, Hamburg, Germany - Professor Chien-Chong Hong
National Tsing Hua University Department of Power Mechanical Engineering, No. 101, Section 2, Kuang-Fu Road, 30013, Hsinchu, Taiwan - Professor Beomjoon Kim
The University of Tokyo, Bunkyo-Ku, 113-0033, Tokyo, Japan - Professor Dong Sung Kim
Pohang University of Science and Technology Department of Mechanical Engineering, 77 Cheongam-Ro, Nam-Gu, 37673, Pohang, South Korea - Professor Wu LU
Ohio State University Department of Electrical and Computer Engineering, 205 Dreese Labs; 2015 Neil Avenue, Columbus, Ohio, 43210, United States - Dr. Mario Lanza
Institute of Functional Nano and Soft Materials, Suzhou, China - Dr. Jaejong Lee
Korea Institute of Machinery and Materials Nano-Convergence Mechanical Systems Research Division, 156 Gajeongbuk-Ro, 305-343, Daejeon, Korea, Republic of - Dr. Sangho Lee
Korea Insitiute of Industrial Technology, Ansan-si, Korea, Republic of - Dr. Rodolphe Marie
Technical University of Denmark, 2800, Kgs Lyngby, Denmark - Dr. Jean Francois de Marneffe
Interuniversity Micro-Electronic Centre, 3001, Leuven, Belgium - Dr. Sunggook Park
Louisiana State University Department of Mechanical & Industrial Engineering, 2514B Patrick F. Taylor Hall, Baton Rouge, Louisiana, 70803, United States - Dr. Fransesc Pérez-Murano
Microelectronics Institute of Barcelona, E-08193, Cerdanyola del Valles, Spain - Dr. Edward Song
University of New Hampshire, Department of Electrical and Computer Engineering, Durham, NH 03824, United States - Professor Li Tao
Southeast University School of Materials Science and Engineering, Nanjing, China - Prof. Dr. Dimitris Tsoukalas
National Technical University of Athens, Athens, Greece - Dr. Jeroen Van Kan
National University of Singapore, 119260, Singapore, Singapore - Prof. Dr. Shaowei Wang
Shanghai Institute of Technical Physics Chinese Academy of Sciences, 188 Xinlai Rd, Jiading Qu, 201815, Shanghai Shi, China - Professor Sheng-Joue Young
National Formosa University, 632, Huwei, Taiwan
Advisory Editors, Europe
- Professor Nuria Barniol
Autonomous University of Barcelona, Barcelona, Spain - Dr. Holger Becker
Microfluidic ChipShop GmbH, Jena, Germany - Dr. Hubert Brückl
Institute for Integrated Sensor Systems, Wiener Neustadt, Austria - Dr. Yong Chen
University College Paris, Paris, France - Professor Massimo De Vittorio
University of Salento, Lecce, Italy - Dr. Michel Despont
CSEM Zurich, Zurich, Switzerland - Dr. Zahid A. K. Durrani
Imperial College London, London, United Kingdom - Dr. Thomas Ernst
French Alternative Energies and Atomic Energy Commission Electronics and Information Technology Laboratory, Grenoble, France - Dr. Maria Farsari
Foundation of Research and Technology Hellas Library, Irakleio, Greece - Dr. Guglielmo Fortunato
Institute for Microelectronics and Microsystems National Research Council, Catania, Italy - Dr. Nikolaj Gadegaard
University of Glasgow, Glasgow, Scotland, United Kingdom - Dr. Jim Greer
University College Cork National University of Ireland, Cork, Ireland - Dr. Cornelis Wouter Hagen
TU Delft, Delft, Netherlands - Dr. Mervyn E. Jones
Imperial College London, London, United Kingdom - Professor Dieter Kern
Eberhard Karls University Tübingen, Munich, Germany - Dr. Salvo Mirabella
University of Catania, Catania, Italy - Dr. David Peyrade
Microelectronic Technology Laboratory, Grenoble, France - Dr. Ivo Rangelow
Ilmenau University of Technology, Ilmenau, Germany - Dr. Helmut Schift
Paul Scherrer Institute, Villigen, Switzerland - Prof. Dr. Urs Staufer
TU Delft, Delft, Netherlands - Dr. Maria Tenje
Uppsala University, Uppsala, Sweden - Dr. Christophe Vieu
Toulouse School of Engineering, Toulouse, France
Advisory Editors, America
- Dr. Mohamed Chaker
National Institute of Scientific Research, Quebec, Quebec, Canada - Dr. Panos Datskos
Oak Ridge National Laboratory, Oak Ridge, Tennessee, United States - Professor Demetre Economou
University of Houston, Houston, Texas, United States - Dr. Stephane Evoy
University of Alberta, Edmonton, Alberta, Canada - Dr. Gregg Gallatin
Applied Math Solutions LLC, Newtown, Connecticut, United States - Mr. John Hartley
Nuflare Technology America Inc, Sunnyvale, California, United States - Dr. Patrick Naulleau
E O Lawrence Berkeley National Laboratory, Berkeley, California, United States - Professor Ian Papautsky
University of Illinois at Chicago, Chicago, Illinois, United States - Professor Kimberly Turner
University of California Santa Barbara, Santa Barbara, California, United States - Professor Joseph Wang
University of California San Diego Department of Nanoengineering, San Diego, California, United States
Advisory Editors, Asia-Oceania
- Dr. Hsuen-Li Chen
National Taiwan University, Taipei, Taiwan - Dr. Toshiaki Iwamatsu
Renesas Electronics Corporation, Koto-Ku, Japan - Dr. Ran Liu
Fudan University, Shanghai, China - Professor Hidenori Mimura
Shizuoka University Research Institute of Electronics, Hamamatsu, Japan - Professor Dacheng Wei
Fudan University, Shanghai, China
Assistant to Editor-in-Chief
- Ms. Maria Martha Tzianou
Institute of Nanoscience and Nanotechnology, Athens, Greece