Composites Science and Technology publishes refereed original articles on the fundamental and applied science of engineering composites. The focus of this journal is on polymeric matrix composites with reinforcements/fillers ranging from nano- to macro-scale. CSTE encourages manuscripts reporting unique, innovative contributions to the physics, chemistry, materials science and applied mechanics aspects of advanced composites.

Besides traditional fiber reinforced composites, novel composites with significant potential for engineering applications are encouraged. These may include, but are not limited to, nanocomposites, biomedical composites, green/eco composites, energy composites, and composites mimicking natural materials. Manuscripts dealing with multi-scale and multi-functional issues and performance as well as interdisciplinary approaches to the study of new generation composite materials are welcome. Analytical work should be validated. Publication of manuscripts reporting routine processing, synthesis and property characterization are not a priority of CSTE.

In order to expedite the handling of submissions, manuscripts will be given a preliminary review prior to the full reviewing process to evaluate their suitability for CSTE. General Review articles as well as Feature articles covering topics of major interests to the readers will be presented at regular intervals, often at the invitation of the Editors. CSTE does not accept short communications or letters. It is the aim of CSTE to play an effective role in the rapid dissemination of research findings in the ever-evolving field of composite materials.

Editorial board

Editor-in-Chief

  • Tsu-Wei Chou
    Dept. of Mechanical Engineering, University of Delaware, 126 Spencer Lab, Newark, Delaware, DE 19716-3140, USA

Editors

  • J.-C. Han
    Harbin Institute of Technology, Harbin, China
  • Y.W. Mai
    The University of Sydney, Sydney, New South Wales, Australia
  • M. Quaresimin
    Università degli Studi di Padova, Vicenza, Italy
  • K. Schulte
    Technische Universität Hamburg-Harburg (TUHH), Hamburg, Germany
  • W. Yang
    Zhejiang University, Hangzhou, China
  • M.Q. Zhang
    Zhongshan University, Guangzhou, China

Editorial Associates

  • B.E. Choplinsky
    Dept. of Mechanical Engineering, University of Delaware, 126 Spencer Lab, Newark, Delaware, DE 19716-3140, USA
  • C. Zhang
    School of Science, Hangzhou Dianzi University, J. Zhejiang Univ. Sci. Eng. Ser., 38# Zheda Rd., 310028, Hanzhou, China

Honorary Editor

  • B. Harris
    Claverton Down, Bath, UK

Editorial Board

  • L. Asp
    Chalmers University of Technology, Gothenburg, Sweden
  • C.E. Bakis
    Pennsylvania State University, Pennsylvania, USA
  • W. Becker
    Technische Universität Darmstadt, Darmstadt, Germany
  • L. Berglund
    KTH Royal Institute of Technology, Stockholm, Sweden
  • A. Bismarck
    Imperial College London, UK and University of Vienna, Austria
  • A.K. Bledzki
    Universität Kassel, Kassel, Germany and West Pomeranian University of Technology Szczecin, Poland
  • V. M. A. Calado
    Federal University of Rio de Janeiro, Rio de Janeiro, Brazil
  • W.J. Cantwell
    Khalifa University, Abu Dhabi, United Arab Emirates
  • A. Carlsson
    Florida Atlantic University, Boca Raton, Florida, USA
  • J. Cavaillé
    INSA de Lyon, INSA de LYON, France
  • F.K. Chang
    Stanford University, Stanford, California, USA
  • T.W. Clyne
    University of Cambridge, Cambridge, UK
  • W.A. Curtin
    École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
  • S. Du
    Harbin Institute of Technology, Harbin, China
  • P. Ermanni
    Eidgenössische Technische Hochschule (ETH) Zürich, Zürich, Switzerland
  • H. Fan
    Nanjing University of Aeronautics and Astronautics, Nanjing, China
  • K. Friedrich
    Technische Universität Kaiserslautern, Kaiserslautern, Germany
  • Q. Fu
    Sichuan University, Chengdu, China
  • S.Y. Fu
    Chongqing University, Chongqing City, China
  • E.K. Gamstedt
    Uppsala University, Uppsala, Sweden
  • R.F. Gibson
    University of Nevada at Reno, Reno, Nevada, USA
  • S.V. Hoa
    Concordia University, Montreal, Quebec, Canada
  • M. Hojo
    Kyoto University, Kyoto, Japan
  • S.H. Hong
    Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea
  • N. Hu
    Chongqing University, Chongqing, China
  • Y. Huang
    Harbin Institute of Technology, Heilongjiang, China
  • P. Hubert
    McGill University, Montreal, Quebec, Canada
  • T. Ishikawa
    Nagoya University, Nagoya, Japan
  • F.R. Jones
    University of Sheffield, Sheffield, England, UK
  • V. Kostopoulos
    University of Patras, Patras, Greece
  • M.S. Kumosa
    University of Denver, Denver, Colorado, USA
  • P. Ladevèze
    Ecole Normale Supérieure de Paris, France
  • L.J. Lee
    The Ohio State University, Columbus, Ohio, USA
  • W.I. Lee
    Seoul National University (SNU), Gwanak-Gu, Seoul, The Republic of Korea
  • Y. Li
    Tongji University, Shanghai, China
  • J. Llorca
    Polytechnic University of Madrid & IMDEA Materials Institute, Madrid, Spain
  • S. V. Lomov
    KU Leuven, Heverlee-Leuven, Belgium
  • A.C. Loos
    Michigan State University, East Lansing, Michigan, USA
  • R. S. Mauler
    UFRGS, Rio Grande do Sul, Brazil
  • S.T. Mileiko
    Russian Academy of Sciences, Chernogolovka, Moscow, Russian Federation
  • A.N. Netravali
    Cornell University, Ithaca, New York, USA
  • T. Ogasawara
    Tokyo University of Agriculture and Technology, Tokyo, Japan
  • W. Van Paepegem
    Ghent University, Ghent, Belgium
  • C.R. Park
    Seoul National University (SNU), Gwanag-Gu, Seoul, The Republic of Korea
  • S.L. Phoenix
    Cornell University, Ithaca, New York, USA
  • S. Pinho
    Imperial College London, London, UK
  • N.R. Sottos
    University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
  • C. Soutis
    University of Manchester, Manchester, England, UK
  • C.T. Sun
    Purdue University, West Lafayette, Indiana, USA
  • N.H. Tai
    National Tsing Hua University, Hsinchu, Taiwan
  • H.D. Wagner
    Weizmann Institute of Science, Rehovot, Israel
  • H. Wang
    Zhejiang University, Zhejiang, China
  • M. Wang
    The University of Hong Kong, Hong Kong, China
  • B.L. Wardle
    Massachusetts Institute of Technology, Massachusetts, USA
  • A. Waas
    University of Washington, Seattle, Washington, USA
  • X.-L. Xie
    Huazhong University of Science and Technology, Wuhan, China
  • L. Ye
    The University of Sydney, Sydney, New South Wales, Australia
  • D. Zhang
    Shanghai Jiao Tong University, Shanghai, China
  • L. Zhang
    Beijing University of Chemical Technology, Beijing, China
  • Z. Zhang
    National Center for Nanoscience and Technology, Beijing, China