Extreme Mechanics Letters (EML) enables rapid communication of research that highlights the role of mechanics in multi-disciplinary areas across materials science, physics, chemistry, biology, medicine and engineering. Emphasis is on the impact, depth and originality of new concepts, methods and observations at the forefront of applied sciences.

EML publishes letter-sized articles, as well as invited reviews and articles on topics of special interest. The goal is to have the papers published online within 6-8 weeks upon submission.

EML covers experimental, theoretical, and computational mechanics of processes at all size and time scales. Of particular interest is the progress in mechanics that advances the fields of vital importance to the society, including, but not limited to, health science, energy systems, the environment, food and water, climate, and security.

Among the topical areas of interest are:

• Materials of extreme properties, such as exceptional hardness or softness
• Materials under extreme conditions, such as high temperature and high loading rate
• Stretchable, wearable, or implantable electronics for entertainment or healthcare
• Soft robots in manufacturing, surgery and assisted living
• Robots that crawl, run, swim or fly
• Biomimetics that perceive, act, learn and remember
• Active materials in response to mechanical, chemical, electrical, thermal stimuli
• Instability and large deformation in nature and engineering systems
• Force-induced configurational changes of proteins leading to cascades in cellular responses
• Deformation, transport and fracture in high-efficiency batteries
• Interfacial phenomena in interactions between fluids and solids, deformation and failure of materials, and processes of living cells
• Self-assembly of materials and devices
• Thin-membrane origami and kirigami
• Mechanics of 3D printing
• Materials and structures of hierarchical architectures
• Hybrid systems of air, liquids, and solids
• Earthquakes and hydraulic fracture
• Foldable, lightweight structures for space exploration

Editorial board

Editors-in-Chief

  • K. J. Hsia
    Nanyang Technological University, Singapore
  • J. A. Rogers
    Northwestern University Department of Materials Science and Engineering, Evanston, Illinois, United States
  • Z. Suo
    Harvard University John A Paulson School of Engineering and Applied Sciences, Cambridge, Massachusetts, United States

Associate Editors

  • K. Bertoldi PhD
    Harvard University John A Paulson School of Engineering and Applied Sciences, Cambridge, Massachusetts, United States
  • H. Jiang
    Arizona State University Department of Mechanical and Aerospace Engineering, Tempe, Arizona, United States
  • T. Li
    University of Maryland at College Park A James Clark School of Engineering, College Park, Maryland, United States
  • M. Sitti
    Max Planck Institute for Intelligent Systems Department of Physical Intelligence, Stuttgart, Germany
  • S. Zhang
    The Pennsylvania State University Department of Engineering Science and Mechanics, University Park, Pennsylvania, United States

Advisory Board

  • M. C. Boyce
    Columbia University, New York, New York, United States
  • L. B. Freund
    Brown University, Providence, Rhode Island, United States
  • H. Gao
    Nanyang Technological University College of Engineering, Singapore, Singapore
  • Y. Huang
    Northwestern University, Evanston, Illinois, United States
  • J. W. Hutchinson
    Harvard University, Cambridge, Massachusetts, United States
  • D. E. Ingber
    Harvard University Wyss Institute for Biologically Inspired Engineering, Boston, Massachusetts, United States
  • S. Kyriakides
    University of Texas at Austin, Austin, Texas, United States
  • S. Suresh
    Carnegie Mellon University, Pittsburgh, Pennsylvania, United States
  • J. A. Todd
    Pennsylvania State University, University Park, Pennsylvania, United States
  • V. Tvergaard
    Technical University of Denmark, Kgs Lyngby, Denmark
  • G. M. Whitesides
    Harvard University, Cambridge, Massachusetts, United States
  • W. Yang
    Zhejiang University, Hangzhou, China

Editorial Board

  • I. A. Anderson
    The University of Auckland Auckland Bioengineering Institute, Auckland, New Zealand
  • B. Audoly
    Solid Mechanics Laboratory, Palaiseau, France
  • S. Bauer
    Johannes Kepler University Linz, Linz, Austria
  • M. J. Buehler
    Massachusetts Institute of Technology, Cambridge, Massachusetts, United States
  • F. Carpi
    Queen Mary University of London, London, United Kingdom
  • D. Fang
    Beijing Institute of Technology, Beijing, China
  • X. Guo
    Dalian University of Technology, Dalian, China
  • H. T. Johnson
    University of Illinois at Urbana-Champaign, Champaign, Illinois, United States
  • S. P. Lacour
    Federal Polytechnic School of Lausanne, Lausanne, Switzerland
  • J. Li
    Massachusetts Institute of Technology, Cambridge, Massachusetts, United States
  • C. T. Lim
    National University of Singapore, Singapore, Singapore
  • M. C. McAlpine
    University of Minnesota, Minneapolis, Minnesota, United States
  • P. R. Onck
    University of Groningen, Groningen, Netherlands
  • M. L. Oyen
    University of Cambridge, Cambridge, United Kingdom
  • B. L. Pruitt
    Stanford University, Stanford, California, United States
  • P. M. Reis
    Massachusetts Institute of Technology, Cambridge, Massachusetts, United States
  • B. Roman
    Laboratory of Physics and Mechanics of Heterogeneous Media, Paris, France
  • M. T. A. Saif
    University of Illinois at Urbana-Champaign, Champaign, Illinois, United States
  • K. J. Van Vliet PhD
    Massachusetts Institute of Technology Department of Materials Science and Engineering, Cambridge, Massachusetts, United States
  • Q. Zheng
    Tsinghua University, Beijing, China
  • T. Zhu
    Georgia Institute of Technology, Atlanta, Georgia, United States