Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.

The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.

The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:

  1. Metals & Alloys
  2. Ceramics
  3. Nanomaterials
  4. Biomedical materials
  5. Optical materials
  6. Composites
  7. Natural Materials
  8. Organic materials

Please note that not all topics fall within the scope of Materials Characterization. Submissions focused on the topics listed below will not be considered for publication, potential alternative journals are indicated in brackets:

i) thin film semiconductors (Thin Solid Films; Materials Science in Semiconductor Processing)
ii) polymers or polymer composites (Elsevier polymer titles; Composites structures)
iii) mechanical, electrical or other property measurements without any accompanying microstructural characterization (depending on the focus, please consider submitting to Corrosion Science; Wear; Materials Science & Engineering B; Materials & Design)
iv) computation, theory or analysis papers without an accompanying microstructural characterization component (Computational Materials Science; Materials Science & Engineering A; Materials Science & Engineering B; Materials Science & Engineering C)

Editorial board

Editor-in-Chief

  • I. Baker
    Dartmouth College, Hanover, New Hampshire, United States

Associate Editors

  • David Field
    Washington State University, Washington, Washington, United States
  • Heung Nam Han
    Seoul National University (SNU), School of Materials Science and Engineering, Gwanag-Gu, Seoul, Korea, Republic of
  • Joanna McKittrick
    University of California San Diego, La Jolla, California, United States
  • Paul R. Munroe
    University of New South Wales, Sydney, New South Wales, Australia
  • Aude Simar
    Catholic University of Louvain, Louvain-la-Neuve, Belgium
  • Min Song
    Central South University Powder Metallurgy Research Institute, Changsha, China

Editorial Advisory Board

  • Bernard Bewlay
    GE Global Research, Niskayuna, New York, United States
  • Harry Bhadeshia
    University of Cambridge Department of Materials Science and Metallurgy, Cambridge, United Kingdom
  • Nikhilesh Chawla
    Arizona State University, Tempe, Arizona, United States
  • Stephane Godet
    ULB, Bruxelles, Belgium
  • Kenji Kaneko
    Kyushu University, Fukuoka, Japan
  • David Larson
    Imago Scientific Instruments, Madison, Wisconsin, United States
  • Williams Lefebvre
    Materials Physics Group, Saint-Etienne-du-Rouvray, France
  • Yong Liu
    Central South University, Changsha, China
  • Zongyi Ma
    Institute of Metal Research Chinese Academy of Sciences, Shenyang, China
  • Eric Maire
    National Institute of Applied Sciences of Lyon, Villeurbanne, France
  • Knut Marthinsen
    Norwegian University of Science and Technology, Trondheim, Norway
  • Michael Moody
    University of Oxford, Oxford, United Kingdom
  • Pedro Rivera
    Lancaster University, Lancaster, United Kingdom
  • Anthony Rollett
    Carnegie Mellon University, Pittsburgh, Pennsylvania, United States
  • Dominique Schryvers
    University of Antwerp, Antwerpen, Belgium
  • Dong-Woo Suh
    Pohang University of Science and Technology Graduate Institute of Ferrous Technology, Pohang, Korea, Republic of
  • Satyam Suwas
    Indian Institute of Science, Bengaluru, India
  • Douglas Van Citters
    Dartmouth College, Hanover, New Hampshire, United States
  • Shuang Xia
    Shanghai University, Shanghai, China
  • Wei Xiong
    University of Pittsburgh, Pittsburgh, Pennsylvania, United States