Materials Letters is an interdisciplinary journal devoted to rapid communications on the science, applications, and processing of materials.

Materials Letters has an open access mirror journal Materials Letters: X, which has the same aims and scope, editorial board and peer-review process. To submit to Materials Letters: X visit https://ees.elsevier.com/mlblux/default.asp

Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.

Contributions include, but are not limited to, a variety of topics such as:

  • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors, biomaterials and biological materials, advanced materials, metamaterials, high-entropy alloys.
  • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart materials, additive manufacturing, membranes, materials for energy systems.
  • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction.
  • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
  • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
  • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic, photoelectrochemical, photocatalytic, thermoelectric, biological.
  • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive, MOVPE and LPE epitaxial processes, single crystal growth.
  • Machine Learning/Artificial Intelligence - Applied to the discovery and design of materials.

Editorial board

Editor-in-Chief

  • A.R. Boccaccini MSc, Dr.-Ing. habil.
    Friedrich-Alexander University Erlangen-Nuremberg, Erlangen, Germany

Editors

  • R. Arroyave
    Texas A&M University Department of Materials Science and Engineering, 119 Mechanical Engineering Office Bldg, College Station, Texas, 77843-3123, United States
  • M. Carboni
    Institute of Separative Chemistry Marcoule Laboratory of Hybrid System of Separation, Bât. 426 – L1-21 – BP 17171, F-30207, Bagnols sur Ceze, France
  • O.A. Graeve
    University of California San Diego Department of Mechanical and Aerospace Engineering, 9500 Gilman Drive, La Jolla, California, CA 92093-0411, United States
  • J. Hojo
    Kyushu University Faculty of Engineering, Kasuga, 816-8580, Fukuoka, Japan
  • V.V. Kharton
    Institute of Solid State Physics Russian Academy of Sciences, 142432, Chernogolovka, Russian Federation
  • S.E. Rodil
    Autonomous National University of Mexico Materials Research Institute, Postal 70 360 cd, 04510, Ciudad de México, Mexico
  • F. L. de Souza
    Federal University of the ABC Centre for Natural Sciences and Humanities, Av.dos Estados, 5001-Santa Terezinha, Santo Andre, 09210-580, SANTO ANDRE, Brazil
  • B. Straumal
    Institute of Solid State Physics Russian Academy of Sciences, 142432, Chernogolovka, Russian Federation
  • Kyle Webber PhD
    Friedrich-Alexander-University Erlangen-Nurnberg Department of Materials Science and Engineering, Martensstr. 5, 91058, Erlangen, Germany
  • A.F.W. Willoughby
    University of Southampton Engineering Materials Research Group, University Road, SO17 1BJ, Highfield, Southampton, United Kingdom
  • J-M. Yang
    University of California Los Angeles Department of Materials Science and Engineering, Los Angeles, California, CA 90095-1595, United States
  • Y.F. Zheng
    Peking University Department of Material Science and Engineering, No.5 Yi-He-Yuan Road, Hai-Dian District, 100871, Beijing, China

Managing Editors

  • Alessandro Polini
    Institute of Nanotechnology National Research Council, Monteroni di Lecce, Italy
  • Laura Ciammaruchi
    Institute of Materials Science of Barcelona, Barcelona, Spain

Associate Editorial Board

  • Z. Ahmad
    De Montfort University, Leicester, United Kingdom
  • K. Aifantis
    University of Florida, Gainesville, Florida, United States
  • A. Bellosi
    Institute of Science and Technology of Ceramic Materials National Research Council, Faenza, Italy
  • J. Blaker
    The University of Manchester, Manchester, United Kingdom
  • B. Bokstein
    National University of Science and Technology MISiS, Department of Physical Chemistry, Moscow, Russian Federation
  • R. H. R. Castro
    University of California Davis, Davis, California, United States
  • X. Chatzistavrou
    No Organisation - Home based - 113291
  • M. Cinibulk
    Wright-Patterson Air Force Base Air Force Research Laboratory, Dayton, Ohio, United States
  • Paolo Colombo
    University of Padova Department Industrial Engineering, Padova, Italy
  • N. Gao
    University of Southampton, Southampton, United Kingdom
  • H. Gleiter
    Helmholtz Nuclear Research Centre Karlsruhe, Karlsruhe, Germany
  • A. Glezer
    National University of Science and Technology MISiS, Institute for Metal Physics & Functional Materials, Moscow, Russian Federation
  • T. Goto
    Tohoku University, Sendai, Japan
  • D.C. Greenspan
    Spinode Consulting, Gainesville, Florida, United States
  • A. Hozumi
    National Institute of Advanced Industrial Science and Technology Chubu Center Materials Research Institute for Sustainable Development, Nagoya, Japan
  • Emanuel Ionescu
    Darmstadt University of Technology, Darmstadt, Germany
  • J. Jang
    National Central University, Taoyuan City, Taiwan
  • Y. Kaganovsky
    Bar-Ilan University Department of Physics, Ramat-Gan, Israel
  • P. Kao
    Sun Yat-Sen University, Guangzhou, China
  • J.A. Kilner
    Imperial College London Department of Materials, London, United Kingdom
  • P. Kumar
    Indian Association for the Cultivation of Science School of Materials Sciences, Jadavpur, India
  • M. Lanagan
    Pennsylvania State University, University Park, United States
  • T. Laoui
    King Fahd University of Petroleum & Minerals, Al Dhahran, Saudi Arabia
  • Y. Lei
    Central South University, Changsha, China
  • B. Li
    University of Nevada Reno, Reno, Nevada, United States
  • X.G. Li
    University of Science and Technology of China Department of Physics, Hefei, Anhui, China
  • Y.Y. Li
    City University of Hong Kong, Kowloon, Hong Kong
  • T. Lopez
    Metropolitan Autonomous University Cuajimalpa, Ciudad de Mexico, Mexico
  • Z.P. Lu
    University of Science and Technology Beijing State Key Laboratory for Advanced Metals and Materials, Beijing, China
  • X.L. Ma
    Shenyang National Laboratory for Materials Sciences Chinese Academy of Sciences, Shenyang, China
  • J.F. Mano
    University of Aveiro, Aveiro, Portugal
  • V. Novikov
    National University of Science and Technology, Moskva, Russian Federation
  • A. Orlov
    Stony Brook University, Stony Brook, New York, United States
  • P. Reed
    University of Southampton Engineering Materials Research Group, Highfield, Southampton, United Kingdom
  • Y. Sakka
    National Institute for Materials Science International Center for Nanoarchitectonics, Ibaraki, Japan
  • M. Sayer
    Queen's University, Kingston, Ontario, Canada
  • J. Shen
    Intel Corp, Chandler, Arizona, United States
  • T. Siegrist
    Florida State University, Tallahassee, Florida, United States
  • Y. Sugahara
    Waseda University Faculty of Science and Engineering Department of Applied Chemistry Polymer Chemistry, Shinjuku-Ku, Tokyo, Japan
  • M.C. Valadez
    Sistema Nacional de Investigadores, Sonora, Mexico
  • M. Wang
    University of Hong Kong Department of Mechanical Engineering, Hong Kong, Hong Kong
  • W.B. White
    Pennsylvania State University, University Park, United States
  • S. Wolf
    Friedrich-Alexander University Erlangen-Nuremberg, Erlangen, Germany
  • C. Zollfrank
    Technical University of Munich School of Life Sciences Weihenstephan, Freising, Germany

Founding Editor

  • F.F.Y. Wang

Editor Emeritus

  • J.H. Wernick