Applied Materials Today is a multi-disciplinary, rapid-publication journal focused on cutting edge applications of novel materials.

New materials discoveries have led to exciting fundamental breakthroughs. Materials research is now moving towards the translation of these scientific properties and principles to applied technologies. Applied Materials Today covers all aspects of materials application, spanning chemistry, physics, engineering, and biology: publishing high impact articles on novel electronic, optical, mechanical, and energy devices, as well as medicine, the environment and the impact on society.

Part of the Materials Today family, Applied Materials Today offers authors rigorous peer review, rapid decisions, and high visibility. The editors welcome comprehensive articles, short communications and reviews on topics including but not limited to:

  • Two dimensional materials
  • Wearable electronics
  • 3D printing/Additive manufacturing
  • Materials for energy
  • Functional materials
  • Materials synthesis
  • Nanomaterials and nanotechnology
  • Biomaterials and nanomedicine
  • Ramifications on society
  • Health and environmental impact
  • Research commercialization
  • Fundamental principles with a view to specific applications

    • Editorial board

    Editor-in-Chief

    • M. Pumera
      University of Chemistry and Technology, Prague, Czech Republic

    Associate Editor

    • C. Wu
      Shanghai Institute of Ceramics, Shanghai, China

    Editorial Board Members

    • K. Ariga
      National Institute for Materials Science (NIMS), Ibaraki, Japan
    • Z. Bao
      Stanford University, Stanford, California, USA
    • T. Bender
      University of Toronto, Toronto, Ontario, Canada
    • X. Cao
      University of Science and Technology Beijing, Beijing, China
    • H.M. Cheng
      Shenyang National Laboratory for Materials Sciences, China
    • N. Cho
      Nanyang Technological University, Singapore, Singapore
    • S. Cohen
      University of California at San Diego (UCSD), La Jolla, California, USA
    • S. Eigler
      Chalmers University of Technology, Gothenburg, Sweden
    • A. Escarpa
      Universidad de Alcalá, Alcalá de Henares, Spain
    • A.F. Facchetti
      Northwestern University, Evanston, Illinois, USA
    • L. Gang
      Ningbo Institute of Materials Technology and Engineering, Zhejiang, China
    • A. Hirsch
      Friedrich-Alexander-Universität Erlangen-Nürnberg, Erlangen, Germany
    • J.X. Huang
      Northwestern University, Evanston, Illinois, USA
    • H. Imahori
      Kyoto University, Kyoto, Japan
    • K. Kalantar-zadeh
      RMIT University, Melbourne, Victoria, Australia
    • L. Kian Ping
      National University of Singapore, Kent Ridge, Singapore
    • K. Kostarelos
      University of Manchester, Manchester, England, UK
    • C. S. Lee
      City University of Hong Kong, Kowloon, Hong Kong
    • Y.H. Lee
      Sungkyunkwan University (SKKU), Suwon, The Republic of Korea
    • X.-Y. Ling
      Nanyang Technological University, Singapore, Singapore
    • J. Lou
      Rice University, Houston, Texas, USA
    • H. Luo
      New Mexico State University, Las Cruces
    • A. D. Mohite
      Los Alamos National Laboratory, Los Alamos, New Mexico, USA
    • P. Neuzil
      Northwestern Polytechnical University, Xi'an, China
    • S. Pané i Vidal
      ETH Zürich, Zurich, Switzerland
    • H. Peng
      Peking University, Beijing, China
    • J.A. Rogers
      University of Illinois at Urbana-Champaign, Urbana, Illinois, USA
    • E. Saiz Gutierrez
      Imperial College London, London, UK
    • M. Terrones
      Pennsylvania State University, University Park, Pennsylvania, USA
    • H. Wang
      China University of Mining and Technology, Xuzhou, China
    • J. Wang
      University of California at San Diego (UCSD), La Jolla, San Diego, California, USA
    • A.S. Weiss
      The University of Sydney, Sydney, New South Wales, Australia
    • J. Yuan
      Stockholms Universitet, Stockholm, Sweden
    • G. Yushin
      Georgia Institute of Technology, Atlanta, Georgia, USA
    • R. Zboril
      Palacky University, Olomouc, Czech Republic
    • H. Zhang
      Nanyang Technological University, Singapore, Singapore
    • X. Zhang
      Wuhan University, China
    • Z. Zhang
      Zhejiang University, Hangzhou, China