Progress in Polymer Science publishes state-of-the-art overview articles by internationally recognized authorities in polymer science and engineering, one of the fastest growing disciplines. The journal provides a link between original articles, innovations published in patents, and up-to-date knowledge of technology. It publishes review articles on subjects not only within the traditional fields of polymer science - chemistry, physics and engineering involving polymers - but also within interdisciplinary developing fields such as functional and specialty polymers, biomaterials, polymers and drug delivery, polymers in electronic applications, composites, conducting polymers, liquid crystalline materials and the interphases between polymers and ceramics, and new fabrication techniques, where significant contributions are being made.

Contributors are usually invited by the Editor; however, authors wishing to submit a review to the journal may do so by first submitting a Proposal Form for consideration by the Editors. Upon submission, the proposal will be reviewed by the Editors for suitability and fit, and if appropriate, an invitation to submit the full paper will be extended. Proposal forms should be submitted via Evise, and authors should select "Proposal" as the article type. Unsolicited manuscripts submitted without a proposal form will not be considered.

Benefits to authors
We also provide many author benefits, such as free PDFs, a liberal copyright policy, special discounts on Elsevier publications and much more. Please click here for more information on our author services.

Please see our Guide for Authors for information on article submission. If you require any further information or help, please visit our Support Center.

Editorial board

Editors-in-Chief

  • G.C. Berry
    Dept. of Chemistry, Carnegie Mellon University, 4400 Fifth Avenue, Pittsburgh, Pennsylvania, PA 15213-2683, USA
  • K. Matyjaszewski
    Dept. of Chemistry, Carnegie Mellon University, 4400 Fifth Avenue, Pittsburgh, Pennsylvania, PA 15213-2683, USA

Editor

  • M. Bockstaller
    Carnegie Mellon University, Pittsburgh, Pennsylvania, USA

Assistant to the Editors

  • E. Tkacik
    Dept. of Chemistry, Carnegie Mellon University, 4400 Fifth Avenue, Pittsburgh, Pennsylvania, 15213, USA

Editorial Board

  • T. Aida
    The University of Tokyo, TOKYO, Japan
  • A.C. Albertsson
    KTH Royal Institute of Technology, Stockholm, Sweden
  • M. Antonietti
    Max Planck Institute (MPI) of Colloids and Interfaces, Potsdam, Germany
  • S. Armes
    University of Sheffield, Sheffield, UK
  • N. Balsara
    Lawrence Berkeley National Laboratory, Berkeley, California, USA
  • C. Barner-Kowollik
    Karlsruhe Institute of Technology (KIT), Karlsruhe, Germany
  • Y. Gnanou
    King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia
  • N. Hadjichristidis
    King Abdullah University of Science and Technology (KAUST), Thuwal, Saudi Arabia
  • C.J. Hawker
    University of California at Santa Barbara, Santa Barbara, California, USA
  • M. Kamigaito
    Nagoya University, Nagoya, Japan
  • R. Khokhlov
    M.V. Lomonosov Moscow State University, Moscow, Russian Federation
  • T. Kowalewski
    Carnegie Mellon University, Pittsburgh, Pennsylvania, USA
  • S. Kumar
    Columbia University, New York, New York, USA
  • L. Leibler
    École Supérieure de Physique et de Chimie Industrielles (ESPCI), Paris, France
  • B. Liu PhD
    National University of Singapore, Singapore
  • J-F. Lutz
    Institut Charles Sadron, Strasbourg Cedex 2, France
  • M. Möller
    RWTH Aachen University (RWTH), Aachen, Germany
  • A.H.E. Mueller
    Johannes Gutenberg Universität Mainz, Mainz, Germany
  • K. Noonan PhD
    Carnegie Mellon University, Pittsburgh, Pennsylvania, USA
  • N.A. Peppas ScD
    University of Texas at Austin, Austin, Texas, USA
  • M. Stenzel
    UNSW Australia, Sydney, Australia
  • B.S. Sumerlin
    University of Florida, Gainesville, District of Columbia, USA
  • B.-Z. Tang
    Hong Kong University of Science and Technology, Hong Kong, China
  • D.A. Tirrell
    California Institute of Technology, Pasadena, California, USA
  • M.W. Urban
    Clemson University, Clemson, South Carolina, USA
  • K.I. Winey
    University of Pennsylvania, Philadelphia, Pennsylvania, USA
  • K. Wooley
    Texas A & M University, College Station, Texas, USA
  • Y. Yagci
    Istanbul Technical University, Istanbul, Turkey
  • X. Zhang
    Tsinghua University, Beijing, China
  • S. ZHU
    McMaster University, Hamilton, Ontario, Canada