The Journal of Colloid and Interface Science publishes original research findings on fundamental principles of colloid and interface science, as well as conceptually novel applications of these in advanced materials, nanomedicine, energy, environmental technologies, catalysis, and related fields. Criteria for publication are impact, quality, novelty and originality.

The Journal of Colloid and Interface Science emphasizes fundamental scientific innovation within the following categories:

A. Colloidal Materials and Nanomaterials
B. Soft Colloidal and Self-Assembly Systems
C. Adsorption, Catalysis and Electrochemistry
D. Interfacial Processes, Capillarity and Wetting
E. Biomaterials and Nanomedicine
F. Energy Conversion and Storage, and Environmental Technologies

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Editorial board


  • M. Malmsten PhD
    University of Copenhagen Department of Pharmacy, København, Denmark

Managing Editor

  • A.T. Hubbard
    Santa Barbara, California, United States


  • T.J. Bandosz PhD, DSC
    City University of New York, New York, New York, United States
  • D. Berti
    University of Florence, Firenze, Italy
  • B. Boyd
    Monash University, Clayton, Victoria, Australia
  • J. Eastoe
    University of Bristol, Bristol, United Kingdom
  • M.A. López-Quintela
    University of Santiago de Compostela, Santiago de Compostela, Spain
  • G.-Q.M. Lu
    University of Surrey, Guildford, United Kingdom
  • S.-B. Wang
    The University of Adelaide School of Chemical Engineering and Advanced Materials, Adelaide, South Australia, Australia
  • G. Zheng
    Fudan University, Shanghai, China

Assistant Editor

  • P. Domínguez Ríos
    University of Santiago de Compostela, Santiago de Compostela, Spain
  • W. Li
    Saint Peter's University, Jersey City, New Jersey, United States
  • L. Liu
    University of Surrey, Guildford, United Kingdom
  • M. Mamusa
    University of Florence, Firenze, Italy
  • M. Salim
    Monash Institute of Pharmaceutical Sciences, Parkville, Australia
  • J. Tang
    Fudan University, Shanghai, China

Advisory Board

  • Z. Adamczyk
    Krakow, Poland
  • J. Arcibar-Orozco
    Leon, Mexico
  • P. Baglioni
    Firenze, Italy
  • A. Bhunia
    Kolkata, India
  • B. Bhushan
    Columbus, Ohio, United States
  • S. Biswal
    Houston, Texas, United States
  • J. P. Chen
  • Chang-Hwan Choi
    Stevens Institute of Technology, Hoboken, New Jersey, United States
  • R.R. Dagastine
    Melbourne, South Australia, Australia
  • J. L. Delgado
    Donostia-San Sebastian, Spain
  • E. Deliyanni
    Thessaloniki, Greece
  • Y.H. Deng
    Shanghai, China
  • J. Dey
    Kharagpur, India
  • J. Dong
    Wuhan, China
  • P. Dowding
    Abingdon, United Kingdom
  • C.A. Dreiss
    London, United Kingdom
  • Y. Du
    Suzhou, China
  • G. D’Errico
    Napoli, Italy
  • K. Edler
    Bath, United Kingdom
  • Y. Feng
    Chengdu, Sichuan, China
  • A.F. Fery
    Dresden, Germany
  • M. Florent
    New York, New York, United States
  • Minglai Fu
    Huaqiao University - Quanzhou Campus, Quanzhou, China
  • G. Garnier
    Clayton, Victoria, Australia
  • V.M. Gun'ko
    Kiev, Ukraine
  • G. Ji
    Nanjing, China
  • K.P. Johnston
    Austin, Texas, United States
  • P.V. Kamat
    Notre Dame, Indiana, United States
  • M. Kruk
    New York, New York, United States
  • J.B. Li
    Beijing, China
  • J. Lützenkirchen
    Karlsruhe, Germany
  • O. Manor
    Haifa, Israel
  • D. J. McClements
    Amherst, Massachusetts, United States
  • Likun Pan
    East China Normal University, Shanghai, China
  • W. Parak
    Hamburg, Germany
  • D. Petsev
    Albuquerque, New Mexico, United States
  • M. Rutland
    Stockholm, Sweden
  • J.-M. Ruysschaert
    Bruxelles, Belgium
  • Saravanakumar
  • B.-L. Su
    Namur, Belgium
  • R.F. Tabor
    Clayton, Victoria, Australia
  • P. Tartaj
    Madrid, Spain
  • R.D. Tilton
    Pittsburgh, Pennsylvania, United States
  • I. Tucker
    Wirral, United Kingdom
  • W. de Vos
    Enschede, Netherlands
  • J. Walz
    Milwaukee, Wisconsin, United States
  • M. Wang
    Beijing, China
  • E.J. Wanless
  • Catherine Whitby
    Massey University, Wellington, New Zealand
  • D.Q. Wu
    Shanghai, China
  • X. Yan
    Shanghai, China
  • B. Yang
    Changchun, Jilin, China
  • M. Yates
    Rochester, New York, United States
  • D. Y. Zhao
    Shanghai, China

Editor Emeritus

  • D.T. Wasan
    Chicago, Illinois, United States

Past Editors

  • V.K. La Mer
  • A.C. Zettlemoyer
  • M. Kerker
  • J.P. Kratohvil
  • H. Kunieda‡