Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor. The scope of Thin Solid Films is indicated by, but not limited to, the following topical subheadings:

• A. Synthesis and Characterization
• B. Surfaces, Interfaces, and Colloidal Behaviour
• C. Metallurgical, Protective, and Hard Layers
• D. Mechanics and Nanomechanics of Thin Layers
• E. Electronics, Optics, and Opto-electronics
• F. Magnetics and Magneto-optics
• G. Superconductivity
• H. Langmuir—Blodgett, Biological, and Related Films
• I. Thin Film Devices, Sensors, and Actuators
• J. Condensed Matter Film Behaviour.

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Editorial board


  • J.E. Greene
    University of Illinois Urbana-Champaign Materials Research Lab, Urbana, Illinois, United States of America

Co Editor-in-Chief

  • P. Desjardins
    Polytechnique Montréal Department of Engineering Physics, Montréal, Quebec, Canada

Associate Editors

  • D. Abou-Ras
    Helmholtz Center Berlin for Materials and Energy, Berlin, Germany
  • Z.H. Barber
    University of Cambridge Department of Materials Science and Metallurgy, Cambridge, United Kingdom
  • T.A. Gessert
    Gessert Consulting LLC, Conifer, Colorado, United States of America
  • C. S. Lee PhD
    City University of Hong Kong Department of Chemistry, Hong Kong, Hong Kong

Editorial Board

  • T.L. Alford
    Arizona State University, Dept. of Chemical & Materials Engineering, Tempe, Arizona, United States of America
  • J.-M. Baribeau
    National Research Council Canada Institute for Microstructural Sciences, Ottawa, Ontario, Canada
  • P.B. Barna
    Institute of Technical Physics and Materials Science, Budapest, Hungary
  • J.P. Chu
    National Taiwan University of Science and Technology Department of Materials Science and Engineering, Taipei, Taiwan
  • M.-A. De Paoli
    State University of Campinas Institute of Chemistry, CAMPINAS, Brazil
  • A. Djurisic
    The University of Hong Kong School of Biomedical Sciences, Hong Kong, Hong Kong
  • D. Gall
    Rensselaer Polytechnic Institute Department of Materials Science and Engineering, Troy, New York, United States of America
  • C.G. Granqvist
    Uppsala University Department of Engineering, Uppsala, Sweden
  • H.J. Kim PhD
    Yonsei University, School of Electrical and Electronic Engineering, Seodaemun-gu, South Korea
  • Y. Li
    Institute of Chemistry Chinese Academy of Sciences, Beijing, China
  • P.J. Martin
    CSIRO Australian Manufacturing and Materials Precinct, Clayton, Australia
  • A.K. Pal
    Indian Association for the Cultivation of Science School of Materials Sciences, Jadavpur, India
  • J. Patscheider
    Evatec Process Systems AG, Trübbach, Switzerland
  • J.-J. Pireaux
    University of Namur Interdisciplinary Research Unit for Electron Spectroscopy, Namur, Belgium
  • B. Ratner PhD
    University of Washington Department of Bioengineering, Seattle, Washington, United States of America
  • I.K. Schuller
    University of California San Diego Department of Physics, La Jolla, California, United States of America
  • J.A.N.T. Soares
    University of Illinois Urbana-Champaign Materials Research Lab, Urbana, Illinois, United States of America