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Electronic properties news, December 2023

Using a novel manufacturing platform, researchers have increased the electrical conductivity of copper wires by incorporating graphene into them.

A novel superconducting material is uniquely sensitive to outside stimuli, allowing its superconducting properties to be enhanced or suppressed at will.

Using lasers, researchers have managed to observe the ballistic movement of electrons in graphene in real time.

By stacking and twisting two layers of cuprate crystals, researchers have created the world’s first high-temperature superconducting diode.

Researchers have demonstrated that the magnetic moment of chiral phonons is significantly enhanced in topological materials.

tailored dendrites can be exploited to create hierarchical structures in metal alloys that boost both strength and ductility

Improving 2D-materials-based electronic devices

driver training assistance system uses triboelectric sensors on gear shift, steering wheel, and pedals to monitor driving behavior in real time

Researchers have developed a novel fiber where one side is flexible cotton and the other side is a conductive polymer.

Using multimaterial 3D printing, researchers have created self-heating microfluidic devices with built-in heating elements.

By engineering surface forces, researchers can directly integrate 2D materials into devices in a single contact-and-release step.

Researchers have developed a cobalt catalyst that can selectively functionalize specific carbon-hydrogen bonds in compounds with lots of them.

By mapping the structural features of a 2D ferroelectric material, researchers have revealed how domains in the material impact its behavior.

Researchers have used piezoelectric nanoparticles to investigate the physical forces at play in non-Newtonian fluids.

Researchers have found that a 170-year-old law relating electronic conductivity to thermal conductivity does still apply to superconducting cuprates.

By packing together multiple 2D materials, researchers have created a multifunctional 3D-integrated chip for artificial intelligence computing.

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